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Technology of ultrathin display panel and ultrathin display panel

A display panel, ultra-thin technology, applied in the direction of instruments, electrical components, circuits, etc., can solve problems such as unsatisfactory, complex process, display panel thickness, etc., to achieve the effect of reducing production cost, simplifying process, and reducing thickness

Inactive Publication Date: 2018-06-29
苏州市悠文电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The current LED display board is to weld multiple LEDs on the circuit board, and each LED is composed of a single LED chip and a carrier board. The first LED chip is bonded on the carrier board by glue, the second step is welding, the lead wire of the LED chip is welded on the carrier board, and there are multiple LED chips welded on the carrier board; the third step is cutting, and will carry multiple The carrier board of the LED chip is cut into multiple single LEDs, and each single LED is composed of a single LED chip and a single carrier board; the fourth step, SMT, is to weld a single single LED chip on the circuit board , the process is relatively complicated, and the final display panel is relatively thick, which cannot meet the current trend of electronic thinning

Method used

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  • Technology of ultrathin display panel and ultrathin display panel
  • Technology of ultrathin display panel and ultrathin display panel
  • Technology of ultrathin display panel and ultrathin display panel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Embodiment one, such as figure 1 As shown, an ultra-thin display panel process removes the original circuit board 3. The specific process includes the following steps. First, a circuit for supplying power to multiple LED chips 1 is laid on the carrier plate 2, and then the multiple LED chips 1 are placed on the carrier board 2. The chip 1 is solidified on the carrier board 2 in turn, and finally the pins / pads of each LED chip 1 are welded on the carrier board 2; wherein, the plurality of LED chips 1 are arranged on the carrier board in a fully parallel manner 2 on.

Embodiment 2

[0020] Embodiment two, such as figure 2 As shown, an ultra-thin display panel process is the same as the first embodiment, including the following steps: firstly, a circuit for supplying power to multiple LED chips 1 is laid on the carrier board 2, and then the multiple LED chips 1 The crystal is solidified on the carrier board 2 in turn, and finally the pins / pads of each LED chip 1 are welded on the carrier board 2; the difference from Embodiment 1 is that the plurality of LED chips 1 are connected by a matrix line It is laid out on the carrier board 2 , one end of the matrix circuit is connected to the positive pole of the power supply, and the other end is connected to the negative pole of the power supply. A plurality of LED chips 1 located between the two ends of the positive and negative electrodes can all be lighted.

Embodiment 3

[0021] Embodiment three, such as image 3 As shown, an ultra-thin display panel process is the same as the first embodiment, including the following steps: firstly, a circuit for supplying power to multiple LED chips 1 is laid on the carrier board 2, and then the multiple LED chips 1 The crystal is solidified on the carrier board 2 in sequence, and finally the pins / pads of each LED chip 1 are welded on the carrier board 2; the difference from the first embodiment is that several LED chips 1 among the plurality of LED chips 1 The chips 1 are connected in series, and multiple sets of the LED chips 1 connected in series are arranged on the carrier board 2 in parallel.

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Abstract

The invention discloses a technology of an ultrathin display panel. The technology comprises the following steps of firstly, distributing a circuit for energizing a plurality of LED (light emitting diode) chips on a carrying board, sequentially fixing the multiple LED chips on the carrying board, and finally welding a pin / welding pad of each LED chip onto the carrying board; or, firstly, distributing the circuit for energizing the multiple LED chips on a circuit board, sequentially fixing the multiple LED chips on the circuit board, and finally welding the pin / welding pad of each LED chip ontothe carrying board. The invention also discloses the ultrathin display panel; the ultrathin display panel is prepared by the technology of the ultrathin display panel. The technology has the advantages that the original technology of the LED display panel is simplified, and the multiple LED chips are directly fixed onto the circuit board / carrying board through chip fixing and welding types, so that the technology is simplified, and the production cost is reduced; because the thickness of the board for carrying the LED chips is reduced, the thickness of the final display panel is thinner, andthe current trend of electronic thinning is met.

Description

technical field [0001] The invention relates to an ultra-thin display panel technology and an ultra-thin display panel. Background technique [0002] The current LED display board is to weld multiple LEDs on the circuit board, and each LED is composed of a single LED chip and a carrier board. The first LED chip is bonded on the carrier board by glue, the second step is welding, the lead wire of the LED chip is welded on the carrier board, and there are multiple LED chips welded on the carrier board; the third step is cutting, and will carry multiple The carrier board of the LED chip is cut into multiple single LEDs, and each single LED is composed of a single LED chip and a single carrier board; the fourth step, SMT, is to weld a single single LED chip on the circuit board , the process is relatively complicated, and the final display panel is relatively thick, which cannot meet the current trend of electronic thinning. Contents of the invention [0003] In order to over...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62G09F9/33
CPCH01L33/62G09F9/33
Inventor 王友平
Owner 苏州市悠文电子有限公司