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A Method for Laterally Trimming Miniature Magnetic Tunnel Junction Patterns

A magnetic tunnel junction, lateral technology, applied in the manufacture/processing of electromagnetic devices, digital memory information, instruments, etc., can solve the problems of increasing manufacturing costs, failing to meet the requirements of line width, and low density.

Active Publication Date: 2021-12-17
SHANGHAI CIYU INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If 193nm ArF dry process or 248nm KrF lithography technology is used, due to the limitation of the resolution of the lithography machine, then the requirement of making small-sized MTJ line width will not be met; want to prepare small-sized magnetic tunnel junction ( MTJ) array requires finer lithography technology, such as: 193i wet process (immersion), EUV or EBL, etc., which undoubtedly increases the manufacturing cost
At the same time, compared with traditional semiconductors, the MTJ size and pattern density in MRAM circuits are relatively small, which increases the risk of MTJ patterns disappearing during pattern transfer

Method used

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  • A Method for Laterally Trimming Miniature Magnetic Tunnel Junction Patterns
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  • A Method for Laterally Trimming Miniature Magnetic Tunnel Junction Patterns

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Embodiment Construction

[0031] In order to solve the above problems, the present invention provides a method for laterally trimming the miniature magnetic tunnel junction pattern, which defines the magnetic tunnel junction pattern on the photoresist through a photolithography process, and then passes through a two-step lateral trimming process, that is: The trimming of the film layer or photoresist, and the trimming of the hard mask film layer make the originally obtained pattern 1 into a magnetic tunnel junction pattern 2 that is shrunk to a finer size, and finally the magnetic tunnel junction array is completed by an etching process patterned, such as figure 1 shown.

[0032] Preferred embodiments of the method of the present invention are specifically described below.

[0033] figure 2 is a flowchart of a method for laterally trimming a miniature magnetic tunnel junction pattern according to a preferred embodiment of the present invention.

[0034] Such as figure 2As shown, the method for la...

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Abstract

The invention discloses a method for laterally trimming a miniature magnetic tunnel junction pattern, comprising: a first step: sequentially forming a magnetic tunnel junction multilayer film, a hard mask film layer and a sacrificial mask film layer on a bottom electrode substrate; Step: Forming a magnetic tunnel junction pattern, and trimming and miniaturizing the magnetic tunnel junction pattern by using a lateral trimming process; Step 3: Etching the sacrificial mask layer and the hard mask film layer, and using a lateral trimming process to continue the magnetic tunnel The junction pattern is trimmed to obtain a magnetic tunnel junction mask with a finer size; the fourth step: etching the multilayer film of the magnetic tunnel junction to complete the miniaturization of the magnetic tunnel junction.

Description

technical field [0001] The present invention relates to the field of magnetic random access memory (MRAM, Magnetic Random Access Memory) manufacture technology, relate in particular to the preparation of small-sized MRAM circuit, specifically, the present invention relates to using a kind of lateral trimming (TRIM) process to the magnetic tunnel junction (MTJ , Magnetic Tunnel Junction) pattern miniature method. Background technique [0002] In recent years, MRAM using the magnetoresistance effect of MTJ is considered to be the future solid-state non-volatile memory, which has the characteristics of high-speed reading and writing, large capacity and low energy consumption. Ferromagnetic MTJ is usually a sandwich structure, which has a magnetic memory layer, which can change the magnetization direction to record different data; an insulating tunnel barrier layer in the middle; a magnetic reference layer, located on the other side of the tunnel barrier layer, which The direct...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L43/12G11C11/16H10N50/01
CPCG11C11/161H10N50/01
Inventor 张云森肖荣福
Owner SHANGHAI CIYU INFORMATION TECH CO LTD