Cooling structure for electronic equipment
A technology of cooling structure and electronic equipment, applied in the field of electronics, can solve the problem of low energy utilization rate of cooling structure, and achieve the effects of improving energy utilization rate, reducing cost and being convenient to use.
Inactive Publication Date: 2018-06-29
喜读(上海)物联网科技有限公司
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Problems solved by technology
[0005] Aiming at the deficiencies of the prior art, the present invention provides a cooling structure for electronic equipment, which solves the problem of low energy utilization rate of the cooling structure
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[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0020] see Figure 1-3 The present invention provides a technical solution: a cooling structure for electronic equipment, including a first water tank 1, a water pump 2 is fixedly connected to the right side of the first water tank 1, and a water pump 2 is fixedly connected to the top of the first water tank 1 from left to right. The second water tank 3 and the cooling fan 4, the water inlet of the water pump 2 communicates with the inner cavity of the first w...
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The invention discloses a cooling structure for electronic equipment and relates to the technical field of electronics. The cooling structure for the electronic equipment comprises a first water tank,wherein a water pump is fixedly connected to the right side of the first water tank; a second water tank and a heat-dissipating fan are sequentially and fixedly connected to the top of the first water tank from left to right; a water inlet of the water pump is communicated with an inner cavity of the first water tank by a communicating pipe; outgoing water of the water pump is communicated with the top of the second water tank through a guide pipe; the bottom of the second water tank is communicated with the top of the first water tank through a detecting pipe. According to the cooling structure for the electronic equipment, by improvement of the detecting pipe and a cooling plate and matched use of the first water tank, the water pump, the second water tank, the heat-dissipating fan andthe other components, the utilization rate of energy of the cooling structure is improved, the energy consumption of the cooling structure is reduced and heat increase caused by over-high consumptionof the cooling structure is avoided while the cost is reduced.
Description
technical field [0001] The invention relates to the field of electronic technology, in particular to a cooling structure for electronic equipment. Background technique [0002] Electronic components are components of electronic components and small electrical machines and instruments. They are often composed of several parts and can be used in similar products. They often refer to certain parts in industries such as electrical appliances, radios and instruments, such as capacitors and transistors. The general term for sub-components such as hairsprings and springs, common resistors, etc. During the production process of electronic equipment, cooling devices need to be used to cool them. The cooling structure is one of the components of the cooling device. [0003] The traditional cooling structure has a low energy utilization rate. In order to ensure the cooling effect, a large amount of energy needs to be used. While increasing the cost, it is easy to increase the heat caus...
Claims
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IPC IPC(8): H05K7/20
CPCH05K7/20272H05K7/20172H05K7/20209H05K7/20263H05K7/2039
Inventor 严武
Owner 喜读(上海)物联网科技有限公司