Mask frame assembly and manufacturing method thereof
A manufacturing method and frame technology, which are used in semiconductor/solid-state device manufacturing, vacuum evaporation plating, coating, etc., can solve the problem of cost increase, mask folds and warping, and relative positions of support strips and shield strips to the mask. Inability to adjust and other problems to achieve the effect of reducing production costs
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[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0038] An embodiment of the present invention provides a mask integration frame, as shown in FIG. The frame 101 and the second frame 102 are fixedly connected by sheathing; it also includes a plurality of mask sheets 301, as shown in FIG. The opposite ends of the mask sheet 301 are fixed on the first frame 101; the shielding strip 201 and / or the supporting strip 202, as shown in FIG. 2( a), the shielding strip 201 and / or the supporting strip 202 straddle the s...
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