Chemical copper stripping potion and copper stripping method

A chemical and potion technology, applied in the field of chemical copper stripping potion and copper stripping of electroplating clamps, can solve the problems of environmental impact, easy decomposition of hydrogen peroxide, health hazards of employees, etc., and achieve the effect of accelerating stripping and prolonging stripping life

Active Publication Date: 2019-10-29
KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the main product of this process is Cu(NO 3 ) 2 And acid exhaust gas (yellow smoke NO 2 ), not only has a great impact on the environment, but also working in this environment for a long time will also bring harm to the health of employees
[0004] In order to solve the problems of waste gas pollution and hazards to the health of workers in the current traditional process of copper stripping with nitric acid, the sulfuric acid-hydrogen peroxide solution system without nitric acid has been widely used. However, this kind of sulfuric acid-hydrogen peroxide solution system generally has the defect that hydrogen peroxide is easy to decompose.

Method used

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  • Chemical copper stripping potion and copper stripping method
  • Chemical copper stripping potion and copper stripping method
  • Chemical copper stripping potion and copper stripping method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] This embodiment provides a chemical copper stripping potion and a copper stripping method.

[0027] The formula of the chemical copper stripping potion is shown in Table 1. The formula is to add the following substances at the final concentration in the water:

[0028]

[0029] The stripping method comprises the steps:

[0030] (1) prepare the chemical copper stripping potion according to the formula in Table 1 in the frying stick groove;

[0031] (2) Carry out copper stripping treatment on the electroplating clamp rod by vertical immersion, the temperature of the chemical copper stripping solution is 50±2°C during the treatment process, and the supplementary amount of the chemical copper stripping solution is 16L every 40min;

[0032] (3) When Cu in the chemical copper stripping potion 2+ When the concentration reaches 55g / L, replace the chemical copper stripping solution in the deep frying tank.

[0033] In this embodiment, the time for copper stripping of the e...

Embodiment 2

[0035] This embodiment provides a chemical copper stripping potion and a copper stripping method.

[0036] The formula of the chemical copper stripping potion is shown in Table 1. The formula is to add the following substances at the final concentration in the water:

[0037]

[0038] The stripping method comprises the steps:

[0039] (1) prepare the chemical copper stripping potion according to the formula in Table 1 in the frying stick groove;

[0040] (2) Carry out copper stripping treatment on the electroplating clamp bar by horizontal spraying, the temperature of the chemical copper stripping potion is 50±2°C during the treatment process, and the supplementary amount of the chemical copper stripping potion is 20L every 40min;

[0041] (3) When Cu in the chemical copper stripping potion 2+ When the concentration reaches 55g / L, replace the chemical copper stripping solution in the deep frying tank.

[0042] It takes 68 seconds for the electroplating clamp bar to carry...

Embodiment 3

[0044] This embodiment provides a chemical copper stripping potion and a copper stripping method.

[0045] The formula of the chemical copper stripping potion is shown in Table 1. The formula is to add the following substances at the final concentration in the water:

[0046]

[0047] The stripping method comprises the steps:

[0048] (1) prepare the chemical copper stripping potion according to the formula in Table 1 in the frying stick groove;

[0049] (2) Carry out copper stripping treatment on the electroplating clamp rod by means of horizontal spraying, the temperature of the chemical copper stripping potion is 50±2°C during the treatment process, and the supplementary amount of the chemical copper stripping potion is 29L every 40min;

[0050] (3) When Cu in the chemical copper stripping potion 2+ When the concentration reaches 55g / L, replace the chemical copper stripping solution in the deep frying tank.

[0051] It takes 68 seconds for the electroplating clamp bar...

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Abstract

The invention relates to chemical copper stripping drug liquid and a copper stripping method. The chemical copper stripping drug liquid is prepared by adding the following components into water in percentage by mass: 45-55% of sulfuric acid with a final volume concentration of 12-20%, 25-30% of hydrogen peroxide with a final volume concentration of 20-28%, a copper stripping agent with a final mass concentration of 4-10%, a stabilizer with a final mass concentration of 4-10% and copper sulfate with a final concentration of 5-52g / L. According to the chemical copper stripping drug liquid and thecopper stripping method, the copper stripping agent and the stabilizer are added into a drug liquid system with sulfuric acid and hydrogen peroxide; the decomposition of hydrogen peroxide in the chemical copper stripping drug liquid is effectively controlled; the stripping effect is improved; the stripping service life of the chemical copper stripping drug liquid is prolonged.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, and relates to a chemical copper stripping solution and a copper stripping method, in particular to a chemical copper stripping solution and a copper stripping method for electroplating clamps. Background technique [0002] In PCB production, some devices, such as electroplating clamps, need to follow the circuit board and be immersed in the electroplating solution, so a layer of copper will be deposited on the surface. After a period of time, the copper layer needs to be stripped. [0003] In the traditional process, the main principle of copper stripping is to use industrial nitric acid to react with the copper layer on the surface of the device. But the main product of this process is Cu(NO 3 ) 2 And acid exhaust gas (yellow smoke NO 2 ), not only have a great impact on the environment, but also work in this environment for a long time will also bring harm to the health o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23F1/18
CPCC23F1/18
Inventor 戴匡
Owner KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD
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