Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Full-color flexible RGB faceplate and manufacturing method thereof

A flexible, panel-based technology, applied in the field of LED light sources, can solve problems such as limitations, poor reliability, and lack of full-color RGB light colors

Inactive Publication Date: 2018-07-13
苏州市悠文电子有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Except for the blue chip, Flip chip chip has few red and green chips. If you use a front-mounted chip, you need to wire it. The reliability of the wire bonding on the flexible panel is very poor. It is relatively limited to realize the light color of other colors on the flexible substrate. , the existing flexible finished products are basically white light emitted by the Flip chip blue chip plus yellow phosphor excitation, there is no full-color RGB light color

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Full-color flexible RGB faceplate and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0018] See attached figure 1 As shown, a full-color flexible RGB panel in this embodiment includes a light emitting material layer 1 and an electron transport layer 2 located on the light emitting material layer 1, an LED light emitting layer on the electron transport layer 2, and the LED light emitting layer adopts a Flip chip Blue chip 6, Flip chip The surface of the blue chip 6 is sprayed with green phosphor powder 3 and red phosphor powder 4, and a cover glass 5 is arranged on the LED light-emitting layer.

[0019] RGB three-primary-color illuminants are respectively provided with corresponding RGB three-primary-color filter films.

[0020] ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a full-color flexible RGB faceplate. The full-color flexible RGB faceplate comprises a luminescent material layer, an electronic transmitting layer positioned on the luminescent material layer and an LED luminescent layer on the electronic transmitting layer. The LED luminescent layer uses a Flip chip blue chip (6). Green fluorescent powder and red fluorescent powder are sprayed on the surface of the Flip chip blue chip (6). The LED luminescent layer is provided with cover plate glass. The Flip chip blue chip (6) is used, and the green fluorescent powder and red fluorescent powder are sprayed on the surface of the Flip chip blue chip (6), so the corresponding green and red are emitted by the Flip chip blue chip (6). The current blue chip is matched with the Flip chip blue chip (6), so the full-color effect is achieved.

Description

technical field [0001] The invention relates to the technical field of LED light sources, in particular to a full-color flexible RGB panel and a manufacturing method thereof. Background technique [0002] Except for the blue chip, Flip chip chip has few red and green chips. If you use a front-mounted chip, you need to wire it. The reliability of the wire bonding on the flexible panel is very poor. It is relatively limited to realize the light color of other colors on the flexible substrate. , the existing flexible finished products are basically the white light emitted by the Flip chip blue chip plus yellow phosphor excitation, and there is no full-color RGB light color. Contents of the invention [0003] In order to overcome the above-mentioned shortcomings, the object of the present invention is to provide a full-color flexible RGB panel and its manufacturing method, using a Flip chip blue chip, spraying green phosphor and red phosphor on its surface, so that it emits co...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L33/14H01L33/50H01L33/52
CPCH01L33/14H01L33/504H01L33/52
Inventor 王友平
Owner 苏州市悠文电子有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com