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Heat balance regulator used for airborne computer

An airborne computer and thermal balance technology, applied in computing, instrumentation, electrical and digital data processing, etc., can solve problems such as harsh working environment of aircraft, solidified operation of interface board components, and failures.

Inactive Publication Date: 2018-07-17
长沙英倍迪电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Under normal circumstances, the phenomenon that the temperature of the mainboard of the computer is too high is prone to occur during work, so the existing mainboard temperature control is mostly designed for the overheating of the mainboard, for example, a utility model patent with the notification number CN206402627U discloses a kind of heat sink with good heat dissipation Install the motherboard
[0004] However, the working environment of the aircraft is harsh. For example, the flight altitude of a civil aviation aircraft is in the stratosphere, and its climate environment is usually subzero. malfunction

Method used

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  • Heat balance regulator used for airborne computer
  • Heat balance regulator used for airborne computer
  • Heat balance regulator used for airborne computer

Examples

Experimental program
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Embodiment 1

[0023] refer to Figure 1~5 A thermal balance regulator for an airborne computer provided in Embodiment 1 includes a casing 1, which encloses a cavity with an open top, and a thermal regulation device 3 is installed in the cavity, and the thermal regulation device 3 includes two There are three heating films 5 arranged between the metal partitions 4 at the end, and the two ends of the main board 6 are fixed on the metal partitions 4 by locking pieces, and the main board 6 is not in contact with the heating films 5 .

[0024] The heating film 5 is fixed in the metal frame 2 , and both ends of the metal frame 2 are fixed on the metal partition 4 .

[0025] The locking member is a card slot 4.1, which is set on the opposite surface of the metal partition 4 at both ends of the thermal adjustment device 3, and is integrated with the metal partition 4, and the two ends of the main board 6 are embedded in the card slot 4.1.

[0026] The heating films 5 are arranged in parallel, and ...

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PUM

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Abstract

The invention discloses a heat balance regulator used for an airborne computer. The regulator includes an outer shell and at least one heat dissipation plate. The outer shell encloses a cavity of which a top is provided with an opening. A heat regulation device is mounted in the cavity, and includes metal baffles of both ends. At least one heating film is disposed between the metal baffles, and isfixed in a metal frame. Two ends of the metal frame are fixed on the metal baffles through locking pieces. Two ends of a main board are fixed on the metal baffles. The main board does not in contactwith the heating film. According to the heat balance adjuster used for the airborne computer provided by the invention, temperature of the main board is adjusted through a heat adjustment device, an inside thereof has heating and heat preservation functions, an outside has a heat dissipation function, dynamic heat quantity balance can be realized, and the temperature of the main board is controlled to be in a suitable working range.

Description

technical field [0001] The invention relates to the field of airborne computer technology, in particular to a thermal balance regulator. Background technique [0002] With the continuous improvement of aircraft intelligence, the influence of onboard computer on aircraft intelligence is increasing. [0003] Under normal circumstances, the phenomenon that the temperature of the mainboard of the computer is too high is prone to occur during work, so the existing mainboard temperature control is mostly designed for the overheating of the mainboard, for example, a utility model patent with the notification number CN206402627U discloses a kind of heat sink with good heat dissipation installed motherboard. [0004] However, the working environment of the aircraft is harsh. For example, the flight altitude of a civil aviation aircraft is in the stratosphere, and its climate environment is usually subzero. Malfunction. Therefore, it is necessary to heat up the motherboard at a hig...

Claims

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Application Information

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IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 李良陈生良刘毅
Owner 长沙英倍迪电子科技有限公司