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Glass article and method of bonding glass sheet to carrier

A technology of glass products and sheets, applied in chemical instruments and methods, glass/slag layered products, glass production, etc., can solve the problems of limiting the overall weight and flexibility of TFT devices

Active Publication Date: 2021-11-05
CORNING INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The thickness of the glass substrate limits the overall weight and flexibility of the TFT device

Method used

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  • Glass article and method of bonding glass sheet to carrier
  • Glass article and method of bonding glass sheet to carrier
  • Glass article and method of bonding glass sheet to carrier

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Embodiment Construction

[0063] In the following detailed description, for purposes of illustration and not limitation, exemplary embodiments illustrating specific details are given in order to provide a thorough understanding of the various principles and aspects of the present disclosure. It will be apparent, however, to one of ordinary skill in the art, having the benefit of this disclosure, that the embodiments described in this disclosure may be practiced in other embodiments than the specific details disclosed herein. Furthermore, descriptions of well-known devices, methods, and materials may be omitted so as not to obscure the description of the various principles herein. Finally, wherever applicable, the same reference numerals designate the same elements.

[0064] Directional terms (eg, up, down, left, right, front, back, top, bottom) as used herein are only with reference to the drawings as drawn and are not intended to denote absolute orientations.

[0065] Ranges can be expressed herein a...

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Abstract

The substrates and / or sheets described herein have residual surfactants that can be applied to control van der Waals forces, hydrogen bonding, and covalent bonding between the substrate and the sheet. The sheet and substrate are bonded together such that permanent bonding during high temperature processing is prevented but sufficient bonding is maintained to prevent delamination during high temperature processing. The substrate and sheet remain releasable throughout and after high temperature processing.

Description

[0001] Cross References to Related Applications [0002] This application claims priority under 35 U.S.C. §119 to U.S. Provisional Application Serial No. 62 / 257466, filed November 19, 2015, which application is based upon and is hereby incorporated by reference in its entirety. technical field [0003] The present disclosure relates generally to articles and methods of processing sheets on substrates, and more particularly, to articles and methods of processing flexible glass sheets on glass supports. [0004] technical background [0005] Thin-film transistor (TFT) products or touch sensor-based devices can use glass as a substrate. The thickness of the glass substrate limits the overall weight and flexibility of the TFT device. Thus, there is a growing interest in making thinner and lighter portable electronic devices. Due to cost considerations, manufacturers may be expected to use existing installed processing equipment to make thinner, lighter or more flexible devices....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C23/00B32B7/06B32B17/06C03C27/06
CPCB32B7/06B32B17/06C03C23/0075C03C27/06C03C2218/31B32B7/12B32B9/005B32B9/04B32B9/041B32B15/04B32B2250/02B32B2255/00B32B2255/06B32B2255/24B32B2255/26B32B2307/30B32B2307/584B32B2307/732B32B2307/748B32B2457/00B32B2457/20B32B2457/208B32B38/162B32B38/164Y02P40/57B32B2315/08
Inventor K·阿迪比T·张C-C·李J-C·林P·马宗达P-L·曾
Owner CORNING INC