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Full-automatic screen double-sided chip mounter and chip mounting technology thereof

A double-sided, fully automatic technology, applied in optics, instruments, nonlinear optics, etc., can solve the problems of easily crushed glass sheets, the inability to realize efficient and concise connection of production lines, and the long time consumption of the whole line for patching, etc.

Pending Publication Date: 2019-08-27
SHENZHEN ETMADE AUTOMATION EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the double-sided bonding process of polarizers, the following problems need to be solved in domestic technology: 1. The existing polarizer mounter can only complete the bonding of a single polarizer. In the actual production process, the glass sheet is placed on one side After the completion, it is necessary to transfer the material to another placement machine, which cannot achieve efficient and concise connection of the production line, which restricts the increase in placement capacity; 2. The existing single placement machine can generally only complete the single glass sheet and polarizer In the process of feeding, aligning, film tearing and patching, in the actual working process, while the glass sheet or polarizer is in progress in each process, other stations are in a waiting state, resulting in a long time-consuming for the entire line of patching, which becomes a constraint 3. The existing polarizer bonding process generally absorbs the polarizer through a rigid mounting plate, and then uses the tilting rotation of the mounting plate to drive the polarizer close to the side of the glass sheet first, so that After the polarizer is attached to the glass sheet on this side, the polarizer is gradually attached to the glass sheet by rotating the mounting plate. Compared with the whole surface bonding, this bonding process reduces the bonding air bubbles to a certain extent However, due to the rigid structure of the mounting board, it is impossible to completely adhere to the glass sheet in real time during the rotation process, so that its effect on reducing the bonding air bubbles is limited, and the mounting board of the rigid structure is very easy to be crushed during the rotation process glass sheet

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  • Full-automatic screen double-sided chip mounter and chip mounting technology thereof
  • Full-automatic screen double-sided chip mounter and chip mounting technology thereof
  • Full-automatic screen double-sided chip mounter and chip mounting technology thereof

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Embodiment Construction

[0074] The present invention will be further described below in conjunction with accompanying drawing:

[0075] like Figure 1 to Figure 33 As shown, the technical solution adopted by the present invention is as follows: a fully automatic screen double-sided chip mounter, including a first bonding part A, a turning mechanism 12, a second bonding part B and a blanking belt arranged at intervals in sequence 14. After one side of the glass sheet to be pasted is finished in the first bonding part A, it is moved to the turning mechanism 12, and after being turned over by the turning mechanism 12, the other side is completed at the second bonding part B. patch, and export the blanking through the blanking belt 14;

[0076]The above-mentioned first bonding part A and the second bonding part B are respectively equipped with a single-sided bonding device, and the single-sided bonding device includes a glass feeding platform 2, a glass feeding robot 3, a patch platform 4, and a film fe...

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Abstract

The invention discloses a full-automatic screen double-sided chip mounter and a chip mounting technology thereof. The full-automatic screen double-sided chip mounter comprises a first mounting part, aturnover mechanism, a second mounting part and a discharging belt which are arranged at intervals in sequence. After one side surface of a to-be-mounted glass sheet is subjected to chip mounting at the first mounting part, the glass sheet is moved to the turnover mechanism; after the glass sheet is turned over by the turnover mechanism, the other side surface of the glass sheet is subjected to chip mounting at the second mounting part; and the glass sheet is exported and discharged through the discharging belt. According to the chip mounter and the chip mounting technology, automatic and efficient connection of double-sided and single-sided mounting devices is effectively realized; automatic mounting of double polarizers is completed; the functions of alternate film tearing, alternating chip mounting, alternate discharging after chip mounting, and the like are realized; the material waiting time of each process gap is effectively utilized; the chip mounting time is shortened; the chipmounting productivity is effectively improved; the polarizers are adhered by adopting a flexible chip mounting adhesive tape; the attachment of the polarizers is completed by single-sided rolling attachment of a rolling attachment assembly; chip mounting air bubbles are effectively reduced; and the chip mounting quality is improved.

Description

technical field [0001] The invention relates to the field of automatic manufacturing, in particular to a fully automatic screen double-sided mounter and a mounter process thereof. Background technique [0002] In the manufacturing process of LCD screen and OLCD plane, polarizer bonding process is involved. In the actual manufacturing process, it is often necessary to attach polarizers to both sides of the glass sheet, and the side surface of the polarizer needs to be adhered before bonding. The release film is torn off; with the continuous market demand for smart terminal equipment such as mobile phones, the downstream screen manufacturing industry has been greatly developed, and the competition in the domestic screen manufacturing industry is becoming increasingly fierce. Most screen manufacturers are guaranteeing production. While improving quality, breakthroughs in production capacity are also required. For the double-sided bonding process of polarizers, the following pr...

Claims

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Application Information

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IPC IPC(8): G02B1/10G02F1/13G02F1/1335
CPCG02B1/10G02F1/1303G02F1/133528
Inventor 高军鹏
Owner SHENZHEN ETMADE AUTOMATION EQUIP
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