Method and apparatus for processing a substrate in a lithographic apparatus
A lithography equipment, a technology for processing substrates, applied in the field of processing substrates and equipment in lithography equipment, can solve the problems of large complexity, infeasibility of aligning sensors, time-consuming, etc.
Active Publication Date: 2020-03-20
ASML NETHERLANDS BV
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- Application Information
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Problems solved by technology
Also, some patterns may be made of materials that are opaque to the wavelength used by the alignment sensor
To alleviate this, greater complexity must be added to the alignment system
However, given the physical constraints of an alignment sensor, it may not be feasible or desirable because the alignment sensor must fit within the lithographic lithography
[0008] Furthermore, the way of increasing the visibility of the alignment marks to the radiation emitted by the alignment system is time consuming
This reduces the production speed of lithography equipment
Method used
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[0040] Before describing embodiments of the invention in detail, it is beneficial to provide an exemplary environment in which embodiments of the invention may be implemented.
[0041] figure 1 A lithographic apparatus LA is schematically shown. The lithographic apparatus comprises: an illumination system (illuminator) IL configured to condition a radiation beam B (e.g. UV radiation or DUV radiation); a patterning device support or support structure (e.g. a mask table) MT configured For supporting a patterning device (eg, a mask) MA and connected to a first positioning device PM configured to precisely position the patterning device according to specific parameters; two substrate tables (eg, a wafer table) WTa and WTb, each configured to hold a substrate (e.g., a resist-coated wafer) W, and each connected to a second positioner PW configured to precisely position the substrate according to specified parameters; and a projection system The (eg refractive projection lens syste...
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A lithographic apparatus has a substrate table on which a substrate is positioned and an alignment sensor for measuring the alignment of the substrate. In an exemplary processing method, an alignment sensor is used to perform one or more edge measurements in a first step. In a second step, one or more edge measurements are performed on the recess of the substrate. The edge measurements are then used to align the substrate in the lithographic apparatus. In a particular example, the substrate is arranged relative to the alignment sensor such that a portion of the edge surface is positioned at the focal length of the lens. The presence of the edge of the substrate is detected when the alignment sensor detects radiation scattered by the edge surface at the focal length of the lens.
Description
[0001] Cross References to Related Applications [0002] This application claims priority from European Application No. 15196993.8 filed on November 30, 2015, which is hereby incorporated by reference in its entirety. technical field [0003] The invention relates to a method and an apparatus for processing a substrate in a lithographic apparatus. In particular, the invention relates to the alignment of substrates in lithographic apparatus. Background technique [0004] A lithographic apparatus is a machine that applies a desired pattern to a substrate, usually a target portion of the substrate). For example, lithographic equipment may be used in the manufacture of integrated circuits (ICs). In this case, a patterning device, alternatively referred to as a mask or reticle, may be used to generate the circuit pattern to be formed on the individual layers of the IC. The pattern can be transferred onto a target portion (eg, containing a portion, one or more dies) on a substr...
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IPC IPC(8): G03F9/00
CPCG03F9/7011G03F7/70141G03F9/7046
Inventor C·桑切斯-法布里斯 科巴里德F·G·C·比基恩E·M·胡尔塞布斯A·J·登鲍埃夫M·H·M·比姆斯P·M·斯托拉日
Owner ASML NETHERLANDS BV