Heat dissipation module and manufacturing method thereof
A technology of heat dissipation module and manufacturing method, which is applied in the direction of cooling/ventilation/heating transformation, modification by using liquid cooling, etc., which can solve the problems of limited design, copper pillar processing, difficult fabrication and assembly, limited heat dissipation efficiency, etc., and achieve simplified structure and manufacturing process, improve heat transfer efficiency, and easy fabrication and assembly
Active Publication Date: 2019-11-26
ACER INC
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Problems solved by technology
However, the processing, production and assembly of copper pillars are relatively difficult, and the applicable designs are also relatively limited
In addition, the heat dissipation module usually only includes one circuit, and the heat dissipation performance that can be achieved is still limited.
Method used
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[0049] figure 1 It is a schematic diagram of a heat dissipation module according to the first embodiment of the present invention. Please refer to figure 1 , in this embodiment, the heat dissipation module 100a is suitable for electronic equipment. Electronic devices are, for example but not limited to, notebook computers or tablet computers. The electronic device has a heat source 10, such as but not limited to a central processing unit or a graphics card. The heat dissipation module 100a can absorb the heat generated by the heat source 10, and then dissipate the heat from other parts of the electronic device (such as the casing).
[0050] figure 2 is a partially enlarged view of the first embodiment of the present invention. Such as figure 1 and figure 2 As shown, the heat dissipation module 100 a of this embodiment includes an evaporator 110 , a first pipe 120 , a second pipe 130 and a working fluid F. As shown in FIG. The evaporator 110 includes a tank body 112 (...
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The invention provides a cooling module, which is applicable to an electronic device. The electronic device is provided with a heat source. The cooling module comprises an evaporator, a first pipe anda working fluid, wherein the evaporator comprises a tank and a first plate piece assembled in the tank; the tank is provided with a cavity; the first plate piece is provided with multiple convex sheets, and the multiple convex sheets are arranged and erected in the cavity; the evaporator is thermally contacted with the heat source to absorb heat generated by the heat source; the first pipe is connected with the cavity and a first loop is formed; and the working fluid fills the cavity and the first loop. Besides, the invention also provides a cooling module manufacturing method. According to the cooling module provided in the invention, through the multiple convex sheets arranged in the evaporator, the cooling efficiency is improved, and the manufacturing process can be simplified.
Description
technical field [0001] The invention relates to a heat dissipation module and a manufacturing method thereof, in particular to a heat dissipation module suitable for electronic equipment and a manufacturing method thereof. Background technique [0002] With the development of communication technology, electronic devices such as mobile phones or tablet computers have become an indispensable necessity in modern people's lives, and as people's dependence on these electronic devices gradually increases, the use time is getting longer and longer; however Prolonged use of electronic equipment often causes the integrated circuits of the electronic equipment to shut down unexpectedly due to overheating, which is really inconvenient. [0003] The current common heat dissipation module, such as the heat dissipation module disclosed in Taiwan Patent Publication No. I558305, includes that when the working fluid flows through the evaporator, it can change due to heat absorption, so as to...
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IPC IPC(8): H05K7/20
CPCH05K7/20309
Inventor 王勇智柯召汉廖文能郑丞佑谢铮玟
Owner ACER INC