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Apparatus and method for loading a substrate into a vacuum processing module, apparatus and method for treatment of a substrate for a vacuum deposition process in a vacuum processing module, and system for vacuum processing of a substrate

A technology of vacuum treatment and substrate carrier, which is applied in the direction of vacuum evaporation plating, metal material coating process, coating, etc.

Inactive Publication Date: 2018-07-31
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Substrate is a large area substrate

Method used

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  • Apparatus and method for loading a substrate into a vacuum processing module, apparatus and method for treatment of a substrate for a vacuum deposition process in a vacuum processing module, and system for vacuum processing of a substrate
  • Apparatus and method for loading a substrate into a vacuum processing module, apparatus and method for treatment of a substrate for a vacuum deposition process in a vacuum processing module, and system for vacuum processing of a substrate
  • Apparatus and method for loading a substrate into a vacuum processing module, apparatus and method for treatment of a substrate for a vacuum deposition process in a vacuum processing module, and system for vacuum processing of a substrate

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Embodiment Construction

[0029] Reference will now be made in detail to various embodiments of the disclosure, one or more examples of which are illustrated in the accompanying drawings. In the following description of the drawings, the same reference numerals refer to the same parts. Only differences relating to individual embodiments are described. Each example is provided by way of explanation of the disclosure and is not meant to be a limitation of the disclosure. Furthermore, what is described or recited as one embodiment can be used on or combined with other embodiments to yield still other embodiments. The description is intended to cover such modifications and variations.

[0030] Embodiments of the present disclosure direct a gas flow across at least one surface of a substrate, such as a large area substrate, in a controlled manner. The gas flow may be used for at least one of processing the substrate (eg, prior to loading the substrate into a vacuum processing module) and maintaining the ...

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Abstract

The present disclosure provides an apparatus for loading a substrate into a vacuum processing module. The apparatus includes a Bernoulli-type holder having a surface configured to face the substrate,and a gas supply configured to direct a stream of gas between the surface and the substrate, wherein the Bernoulli-type holder is configured to provide a pressure between the substrate and the surfaceconfigured for levitation of the substrate. The substrate is a large area substrate.

Description

technical field [0001] Embodiments of the present disclosure relate to an apparatus for loading a substrate into a vacuum processing module, an apparatus configured to process a substrate for a vacuum deposition process in a vacuum processing module, an apparatus for vacuum processing a substrate A system, a method for loading a substrate into a vacuum processing module, and a method for processing a substrate for a vacuum deposition process in the vacuum processing module. Embodiments of the present disclosure particularly relate to pretreatment of substrates, such as degassing, prior to a vacuum deposition process. Background technique [0002] Techniques for layer deposition on substrates include, for example, sputter deposition, thermal evaporation, and chemical vapor deposition. A sputter deposition process may be used to deposit a layer of material, such as a layer of conductive or insulating material, on the substrate. Coated materials can be used in several applica...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/203H01L21/67
CPCC23C14/352C23C14/568C23C16/54H01L21/6838H01J37/342H01J37/345C23C14/566H01J37/3405H01J37/3423H01J37/3452C23C14/35C23C14/042C23C14/50C23C14/24C23C14/3407H01J37/32724H01J2237/20278H01J2237/3321C23C14/564H01J37/32779H01J37/3411H01L21/67H01J37/3417
Inventor 约翰·M·怀特
Owner APPLIED MATERIALS INC