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Top light emitting OLED substrate and preparation method thereof, and OLED display panel

A top emission and substrate technology, which is applied in semiconductor/solid-state device manufacturing, organic semiconductor devices, electrical components, etc., can solve problems such as poor uniformity, uneven ITO surface, and non-uniform distribution of organic films, so as to improve performance and eliminate surface The effect of poor flatness and avoiding influence

Active Publication Date: 2018-08-03
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The preparation of OLED devices by evaporation equipment is the mainstream method of production at present, but the disadvantages of low utilization rate and poor uniformity of evaporation process materials have been lacking effective solutions
Since the liquid film formation process is a process from liquid injection to dry film formation, the organic material components will accumulate to the depression / lower place, so that the formed organic film is not evenly distributed in the s-pixel
Therefore, there is currently an uneven ITO surface in the top-emitting OLED substrate, which affects the uniformity of the film thickness of the light-emitting layer in the IJP film-forming process, thereby affecting the performance of the OLED device.

Method used

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  • Top light emitting OLED substrate and preparation method thereof, and OLED display panel
  • Top light emitting OLED substrate and preparation method thereof, and OLED display panel
  • Top light emitting OLED substrate and preparation method thereof, and OLED display panel

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Embodiment Construction

[0034] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the invention may be practiced. The directional terms mentioned in the present invention, such as [top], [bottom], [front], [back], [left], [right], [inside], [outside], [side], etc., are only for reference The orientation of the attached schema. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention. In the figures, structurally similar elements are denoted by the same reference numerals.

[0035] The present invention aims at the technical problem that in the preparation process of the existing OLED substrate, the ITO surface is poor in flatness, and the thickness of the light-emitting layer prepared by IJP is uneven due to the substrate, thereby affecting the performance of the OLED device. This embodiment can Fix this bug.

[0036] refer to figure 1 ...

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Abstract

The invention provides a top light emitting OLED substrate and a preparation method thereof, and an OLED display panel. The preparation method of the top light emitting OLED substrate comprises the following steps of providing a substrate firstly, and preparing a buffer layer, a thin film transistor layer, a planarization layer, a pixel definition layer and a positive electrode layer on the substrate in sequence, wherein concave parts are formed on the surface of the positive electrode layer; next, printing nanometer silver ink on the concave parts on the surface of the positive electrode surface in a small drop form at the preset volume; next, in a negative pressure environment, enabling a solvent in the nanometer silver ink to be evaporated and removed to separate out nanometer silver toform a nanometer silver compensation block; and next, performing annealing treatment on the substrate at a preset temperature to enable the nanometer silver compensation block and the positive electrode layer to be combined and to share the same plane so as to form a flat positive electrode substrate.

Description

technical field [0001] The invention relates to the field of display panel manufacturing, in particular to a top-emitting OLED substrate, a preparation method thereof, and an OLED display panel. Background technique [0002] Organic electroluminescent devices (OLEDs) have become the most promising new display devices in recent years due to their advantages such as self-luminescence, all-solid-state, and high contrast. The preparation of OLED devices by evaporation equipment is the mainstream method of production at present, but the shortcomings of evaporation process material utilization rate and poor uniformity have been lacking effective solutions. The solution method to prepare OLED thin films shows obvious advantages due to its high material utilization rate and low equipment cost. [0003] The solution process includes spin coating, printing, printing, etc., in which the solution containing the luminescent material is dropped on a predetermined position in the form of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56H01L51/52H01L27/32
CPCH10K71/60H10K59/12H10K2102/3026H10K71/40H10K59/8051H10K71/611
Inventor 郝鹏
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD