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Plating unit and plating device including the same

A technology of plating and plating solution, applied in plating tanks, electrolytic components, electrolytic processes, etc., can solve problems such as difficult plating and uneven plating thickness, and achieve the effect of suppressing uneven plating thickness

Active Publication Date: 2020-06-16
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the object to be plated in the region R opposite to the lower end of the cathode electrode 313 on the radially inner side of the group 350 of the object to be plated is less likely to be plated.
As a result, the plating thickness of the object to be plated may vary

Method used

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  • Plating unit and plating device including the same
  • Plating unit and plating device including the same
  • Plating unit and plating device including the same

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Embodiment Construction

[0047] Hereinafter, one embodiment of a plating device will be described with reference to the drawings. In addition, in order to facilitate understanding, the drawings may show components enlarged. In addition, the dimensional ratios of components may differ from actual dimensional ratios or dimensional ratios in other drawings.

[0048] Such as figure 1 As shown, the plating apparatus 1 includes a plating unit 10 , an anode electrode 20 , a rotating device 30 , a supply pipe 40 , a container 50 , and a control device 60 . The plating unit 10 functions as a container capable of storing a plating solution. In the plating unit 10, the object to be plated 100 (refer to figure 2 ) aggregate (hereinafter referred to as "to-be-plated object group 100A"). The plating unit 10 has an opening 11 that opens upward. The anode electrode 20 is inserted into the plating unit 10 from the opening 11 of the plating unit 10 . The supply pipe 40 is inserted into the opening 11 of the pla...

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Abstract

A plating unit and a plating device including the plating unit suppress unevenness in plating thickness of an object to be plated. The plating unit (10) can store a plating solution and accommodate an object to be plated, and is rotated around a vertical axis (J) by a rotating device (30). The plating unit (10) comprises: a base plate (12); a climbing member (13), which has electrical insulation and has And the first inclined surface (13a) inclined radially outward; and the cathode electrode (14), which is configured to be adjacent to the climbing member (13) in the direction along the vertical axis (J), And it has a second inclined surface (14a) inclined radially outward as it goes upward.

Description

technical field [0001] The present invention relates to a plating unit and a plating device including the plating unit. Background technique [0002] As a plating device, a centrifugal plating device is known. The object to be plated is put into a plating unit in which a plating solution is stored, the unit for plating is rotated, and the object to be plated is placed on the outer periphery. The ring-shaped cathode electrode of the part is contacted to perform electroplating on the object to be plated (for example, refer to Patent Document 1). [0003] refer to Figure 9 , an example of a conventional centrifugal plating device 300 will be described. The centrifugal plating device 300 includes: a unit 310 for plating; a container 320, the container 320 surrounds the unit 310 for plating from the outside; an anode electrode 330, and the anode electrode 330 is inserted in the unit 310 for plating; and a rotating device 340, The rotation device 340 rotates the plating unit 31...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/16C25D7/00
CPCC25D7/00C25D17/16C25D17/02C25D17/10C25D21/10
Inventor 山田尚弘海沼泰明五木田泰男
Owner MURATA MFG CO LTD
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