Electronic detonator chip and packaging method thereof

Abstract

The invention discloses an electronic detonator chip and an encapsulation method. According to the encapsulation method, by conducting dispensing curing hard encapsulation and low pressure injection molding encapsulation on a semi-finished electronic detonator chip, secondary encapsulation of the electronic detonator chip is achieved. In this way, under the premise that it is ensured that a product has the moisture-proof and dustproof functions, the production quality consistency of the electronic detonator chip is improved, the rate of finished products of the electronic detonator chip is increased, and seismic performance in the using process of the product is also improved greatly through double-layer encapsulation protection.

Description

technical field [0001] The invention relates to the technical field of electronic detonators, in particular to an electronic detonator chip and a packaging method thereof. Background technique [0002] In the prior art, after the electronic detonator chip is mounted and the semi-finished product test is completed, the semi-finished electronic detonator chip is directly packaged by a low-pressure injection molding process, and a protective layer is formed on the periphery of the chip to protect the components on the electronic detonator chip. It has functions such as moisture-proof and dust-proof. However, there are two shortcomings in the current electronic detonator chip production and packaging method: the first shortcoming is that the low-pressure injection molding directly encapsulates the components on the electronic detonator chip with melted resin, and the temperature of the melted resin is as high as 170°C , molding pressure 2Kg / cm 2 , high temperature and high pre...

AI Technical Summary

Problems solved by technology

However, there are two shortcomings in the current electronic detonator chip production and packaging method: the first shortcoming is that the low-pressure injection molding directly encapsulates the components on the electronic detonator chip with melted resin, and the temperature of the melted resin is as high as 170°C , molding pressure 2Kg / cm 2 , high temperature and high pressure are easy to cause damage to the components of the electronic detonator chip, resulting in low product quality consistency and low yield; the second disadvantage is that during the blasting process of the electronic detonator chip, due to the close row spacing, the detonation process is delayed In the middle, the seismic wave generated by the electronic detonator detonated first in the center will have an impact on the electronic detonator at the edge, which will cause damage and failure of the components on the chip, resulting in the phenomenon of blast rejection, which will cause safety hazards to the blasting site

Images