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A kind of modified bismaleimide resin suitable for resin transfer molding process and preparation method thereof

A bismaleimide resin and bismaleimide technology are applied in the field of modified bismaleimide resin and its preparation, and can solve the problem of the dielectric properties of the bismaleimide resin. Improvement and evaluation research work is less, and it is difficult to take into account the improvement of heat resistance processability and the weakening of heat resistance, so as to achieve the effects of excellent processability, improved dielectric properties, and excellent heat resistance

Active Publication Date: 2020-07-24
SHAANXI TIANCE NEW MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After curing at 227°C for 4 hours, the glass transition temperature is 271°C, and the heat resistance is weakened
However, the curing temperature required by the system is relatively high, reaching 250°C, and the instability of allyl etherified phenolic aldehyde itself limits its application to a certain extent.
[0010] It can be seen that the current commercial modified bismaleimide resin varieties suitable for RTM still have their own shortcomings in performance, and it is difficult to take into account the maintenance of heat resistance and the improvement of processing technology, and the bismaleimide There is less research work on the targeted improvement and evaluation of the dielectric properties of imide resins

Method used

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  • A kind of modified bismaleimide resin suitable for resin transfer molding process and preparation method thereof
  • A kind of modified bismaleimide resin suitable for resin transfer molding process and preparation method thereof
  • A kind of modified bismaleimide resin suitable for resin transfer molding process and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] In a 500ml glass bottle equipped with a thermometer, an addition funnel and a mechanical stirring device, add 50g of 1-allyl-2-cyanatobenzene, raise the temperature to 140°C, and add 100g of 4,4' within 1 hour - bismaleimide diphenylmethane, and continue to keep warm at 140° C. for 1 hour, and the system is in a homogeneous and transparent state at this time. Cool the system down to 120°C, add 50g of 3-aminobenzocyclobutene, readjust the system temperature to 120°C, add 100g of 4,4′-bismaleimide diphenylmethane within 1 hour, and continue The reaction was incubated at 120° C. for 1 hour. Cool down to obtain a reddish-brown homogeneous and transparent modified bismaleimide resin.

Embodiment 2

[0056] In a 500ml glass bottle equipped with a thermometer, an addition funnel and a mechanical stirring device, add 30g of 1-allyl-2-cyanatobenzene, raise the temperature to 140°C, and add 75g of 4,4' within 1 hour - bismaleimide diphenylmethane, and continue to keep warm at 140° C. for 1 hour, and the system is in a homogeneous and transparent state at this time. Cool the system down to 120°C, add 60g of 3-aminobenzocyclobutene, readjust the system temperature to 120°C, add 120g of 4,4'-bismaleimide diphenylmethane within 1 hour, and continue The reaction was incubated at 120° C. for 1 hour. Cool down to obtain a reddish-brown homogeneous and transparent modified bismaleimide resin.

Embodiment 3

[0058] In a 500ml glass bottle equipped with a thermometer, an addition funnel and a mechanical stirring device, add 60g of 1-allyl-2-cyanatobenzene, raise the temperature to 140°C, and add 120g of 4,4' within 1 hour - bismaleimide diphenylmethane, and continue to keep warm at 140° C. for 1 hour, and the system is in a homogeneous and transparent state at this time. Cool the system down to 120°C, add 30g of 3-aminobenzocyclobutene, readjust the system temperature to 120°C, add 45g of 4,4'-bismaleimide diphenylmethane within 1 hour, and continue The reaction was incubated at 120° C. for 1 hour. Cool down to obtain a reddish-brown homogeneous and transparent modified bismaleimide resin.

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Abstract

The invention provides modified bismaleimide resin applicable to a resin transfer molding process and a preparation method of the modified bismaleimide resin. The resin is low in melting point, viscosity and curing temperature, good in heat resistance and dielectric property, excellent in machining technology and suitable for a RTM (resin transfer molding) process. The preparation method includesthe steps: firstly, heating 1-allyl-2-cyanate benzene to reach the temperature of 130-160 DEG C, adding bismaleimide monomers, and keeping the temperature to perform polymerization reaction to obtaina homogeneous-phase performed polymer; secondly, adding 3-aminobenzocyclobutene into the performed polymer, adjusting the temperature to reach 100-140 DEG C, adding bismaleimide monomers, and keepingthe temperature to perform polymerization reaction to obtain the modified bismaleimide resin applicable to the resin transfer molding process.

Description

technical field [0001] The invention belongs to the technical field of composite material matrix resin materials, and relates to a modified bismaleimide resin suitable for a resin transfer molding process and a preparation method thereof. Background technique [0002] The molecular structure of bismaleimide contains two maleimide rings. Due to its high unsaturated structure, the crosslinking density after curing is large, and its heat resistance is far superior to that of epoxy resin, and it has moisture resistance and radiation resistance. , high modulus, small thermal expansion coefficient and other excellent characteristics. However, the unmodified bismaleimide monomer has high crystallinity and high melting point, is difficult to dissolve in conventional solvents, has high brittleness after solidification, and basically loses its use value. Therefore, it is necessary to modify it to destroy its crystallinity, lower its melting point, improve the processing technology of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/12
CPCC08G73/128
Inventor 赵宗严艾涛江汛张鸿翔
Owner SHAANXI TIANCE NEW MATERIAL TECH
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