Energy-saving type refrigeration component

Abstract

The invention discloses an energy-saving type refrigeration component which comprises a refrigeration end, a semiconductor refrigerator, a heat insulating layer and a heat radiation plate, wherein a semicircular column is arranged on an end surface of the contact part of the semiconductor refrigerator and the refrigeration end; the semicircular column is clamped with the refrigeration end; U-shaped tubes are connected with the side surface of the semicircular column in a cross circulation manner; the U-shaped tubes arranged at two ends of the semiconductor refrigerator are connected through acirculation pipeline; a second micro circulation water pump is arranged at one end of the circulation pipeline; a connecting block is arranged at one end of the semiconductor refrigerator; the connecting block is arranged on the heat radiation plate; connecting plates are communicated with two ends of the connecting block; the bottom ends of the connecting plates are connected through a connectingtube; a first micro circulation water pump is arranged at one end of the connecting tube. By adopting the component, the heat radiation efficiency of the semiconductor refrigerator, the refrigerationend and the semiconductor refrigerator and the heat radiation end is improved, energy consumption is reduced, and more energy is saved.

Description

technical field [0001] The invention relates to the technical field of refrigeration devices, in particular to an energy-saving refrigeration assembly. Background technique [0002] In the semiconductor refrigeration structure in the prior art, the bonding method between the refrigeration end and the semiconductor refrigeration device mostly adopts planar contact. Due to the planar contact method, the contact area between the refrigeration end and the semiconductor refrigeration device is small, so that the heat is dissipated. Inefficiency, which in turn increases the energy consumption of the cooling components. [0003] Reference document: In a semiconductor refrigeration component (authorized announcement number: CN203068867U), a U-shaped groove is arranged between the semiconductor refrigeration device and the refrigeration end to increase the contact area between the semiconductor refrigeration device and the refrigeration end, thereby increasing its heat Radiation eff...

AI Technical Summary

Problems solved by technology

[0002] In the semiconductor refrigeration structure in the prior art, the bonding method between the refrigeration end and the semiconductor refrigeration device mostly adopts planar contact. Due to the planar contact method, the contact area between the refrigeration end and the semiconductor refrigeration device is small, so that the heat is dissipated. Inefficiency, which in turn increases the energy consumption of cooling components

[0003] Reference document: In a semiconductor refrigeration component (authorized announcement number: CN203068867U), a U-shaped groove is arranged between the semiconductor refrigeration device and the refrigeration end to increase the contact area between the semiconductor refrigeration device and the refrigeration end, thereby increasing its heat Radiation efficiency, but the increase in contact area is limited in this technical solution, and there is still the defect of low heat dissipation efficiency. In addition, it uses a finned radiator to force heat dissipation with air, and the heat dissipation effect is limited

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