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Shock and noise attenuation device, manufacturing method thereof, and floating floor structure

A technology of noise attenuation and manufacturing method, which is applied to local raised floors, elastic floors, sound insulation, etc., can solve the problems of waste tire chips such as reduced elasticity, elastic deterioration, and reduced durability, and achieves easy adjustment, easy compression, and reduced durability. sexual effect

Active Publication Date: 2020-08-21
朴钟洙 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Adhesives for waste tire chips release hazardous substances that are a health hazard, so indoor use is restricted
[0007] In addition, since the waste tire chips are bonded to each other by an adhesive, the elasticity of the waste tire chips themselves decreases, and at the same time, the elastic deformation of the waste tire chips is suppressed by the cured adhesive, thereby deteriorating the elasticity
[0008] In addition, chips of waste tires bonded by adhesives are damaged due to repeated impacts, reducing durability and releasing fine dust, etc.
[0009] Furthermore, in the case where the waste tire chips themselves are to be used as an elastic member without an adhesive, there is no device or technique for properly exerting the elastic force of the waste tire chips

Method used

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  • Shock and noise attenuation device, manufacturing method thereof, and floating floor structure
  • Shock and noise attenuation device, manufacturing method thereof, and floating floor structure
  • Shock and noise attenuation device, manufacturing method thereof, and floating floor structure

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Embodiment Construction

[0054] Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. In the drawings, the same reference numerals are used to designate the same elements throughout the drawings, even if shown in different drawings, have the same symbols. In the following description of the embodiments of the present invention, detailed descriptions of related known structures or functions are omitted when they hinder the understanding of the embodiments of the present invention.

[0055] When describing the components of the embodiments of the present invention, the terms first, second, A, B, a, b may be used. These terms are used to distinguish constituent elements from other constituent elements, and the terms do not limit the nature and sequence of the constituent elements. When a constituent element is described as being "connected", "coupled" or "coupled" to another component, the constituent element may be directly to another c...

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Abstract

The present invention relates to a shock and noise reducing device comprising: an elastic member constituted by a collection of a plurality of elastic chips; and an elastic container that compresses the elastic member and receives the same therein, wherein the elastic container includes: a bottom plate; a body coupled to the top side of the bottom plate and having a hollow cylindrical shape, wherein the body is open at the bottom thereof and has an open through-hole formed in the central portion of the top side thereof; and a compressing member provided inside the body and above the elastic member to transmit external shock to the elastic member while vibrating up and down in response to the shock. The present invention is advantageous in that the device does not use a binder and thus there is no emission of hazardous materials, so that the device can also be used indoors; there is no reduction in the elastic capability of the elastic chips, and there is no emission of fine dust or reduction in durability due to damage to the elastic chips or a binder; and it is possible to easily adjust the height and direction of the elastic container by improving the elastic container, to easily compress the elastic chips, and to easily adjust the degree to which the elastic chips are compressed.

Description

technical field [0001] The invention relates to an impact and noise attenuation device, its manufacturing method and a floating floor structure using the attenuation device. Background technique [0002] Recently, with the development of industrial technology and the improvement of living standards, the demand for preventing or reducing noise caused by mechanical devices and interstory noise has been increasing. [0003] On the other hand, in modern society, as the number of cars increases, the amount of waste tires increases, and the problem of environmental pollution caused by waste tires and the cost of disposal also increase. However, waste tires are difficult to handle and insufficiently recycled. [0004] As a method of simultaneously solving the above-mentioned problems, an apparatus and a method of attenuating impact and noise using waste tire chips have been developed. [0005] However, all of these devices or methods are used by bonding crushed waste tire chips w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): E04F15/22E04F15/20E04F15/024E04B1/98E04F15/18E04B1/82B29C43/00B29C43/10
CPCB29C43/00B29C43/10E04B1/82E04B1/98E04F15/024E04F15/18E04F15/20E04F15/22
Inventor 朴钟洙朴珉奭
Owner 朴钟洙
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