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Horizontal sanding apparatus for electroplated diamond wire saw

A technology for electroplating diamond and diamond powder, applied in electrolytic coatings, electrolytic processes, electrolytic components, etc., can solve the problem of high production cost of diamond powder consumption, and achieve the effects of uniform sand application, reduced usage, and high sand content

Inactive Publication Date: 2018-08-24
泰州伟益新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, the disadvantages of the electroplating diamond wire saw production line are becoming more and more obvious. For example, the metal wire that completes the electroplating process needs to pass through the sanding mechanism equipped with diamond powder. The sanding mechanism completes the sanding process, but the diamond powder in the sanding process Excessive dosage can easily lead to higher production costs

Method used

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  • Horizontal sanding apparatus for electroplated diamond wire saw

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Embodiment Construction

[0014] The present invention will be further described below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.

[0015] In the description of the patent of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" The orientation or positional relationship indicated by etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the patent of the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, with a specific The azimuth structure and operation, therefore, cannot be construed as a limitation of the patent of the invention. In addition, the terms...

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Abstract

The invention provides a horizontal sanding apparatus for an electroplated diamond wire saw. The apparatus comprises an electroplating tank, the electroplating tank contains a plating solution, an anode is placed in the plating solution, a sand barrel is horizontally arranged at the bottom of the electroplating tank, the sand barrel is completely immersed in the plating solution, a metal wire is driven to be immersed in the plating solution in the plating tank by a pay-off wheel, goes through the sand barrel from the left to the right, and then departs from the electroplating tank through a take-up wheel, the sand barrel is connected with a driving device capable of driving the sand barrel to rotate with the metal wire as a rotating shaft, a sand inlet for adding diamond powder is arrangedin the top wall surface of the sand barrel, the left end, positioned at a metal wire inlet, of the sand barrel is provided with an impregnation solution opening to communicate with an external plating solution, and the right end, positioned at a metal wire outlet, of the sand barrel is provided with a sand blocking groove to prevent the diamond powder from flowing out with the metal wire. The sanding apparatus has the advantages of uniformity in sanding, high content of sands in the sand barrel, compactness in sanding, no shedding, and reduction of the use amount of the diamond powder.

Description

technical field [0001] The invention relates to the technical field of electroplated superhard material products, in particular to a horizontal sanding device for an electroplated diamond wire saw. Background technique [0002] As the processing requirements for hard and brittle materials are getting higher and higher, cutting tools have become the focus of attention, and bonded abrasive diamond wire saws are considered to be the best cutting tools. Electroplated diamond wire saws have received great attention due to their good performance compared to other manufacturing methods. At the same time, the disadvantages of the electroplating diamond wire saw production line are becoming more and more obvious. For example, the metal wire that completes the electroplating process needs to pass through the sanding mechanism equipped with diamond powder. The sanding mechanism completes the sanding process, but the diamond powder in the sanding process Excessive dosage will easily le...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D17/00C25D21/00C25D7/06C25D15/00
CPCC25D17/00C25D7/0607C25D15/00C25D21/00
Inventor 姚百芬陆勇陆正伟
Owner 泰州伟益新材料科技有限公司
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