The invention provides a horizontal sanding apparatus for an electroplated
diamond wire saw. The apparatus comprises an
electroplating tank, the
electroplating tank contains a plating solution, an
anode is placed in the plating solution, a sand
barrel is horizontally arranged at the bottom of the
electroplating tank, the sand
barrel is completely immersed in the plating solution, a
metal wire is driven to be immersed in the plating solution in the plating tank by a pay-off wheel, goes through the sand
barrel from the left to the right, and then departs from the electroplating tank through a take-up wheel, the sand barrel is connected with a driving device capable of driving the sand barrel to rotate with the
metal wire as a rotating shaft, a sand inlet for adding
diamond powder is arrangedin the top wall surface of the sand barrel, the left end, positioned at a
metal wire inlet, of the sand barrel is provided with an impregnation solution opening to communicate with an external plating solution, and the right end, positioned at a metal wire outlet, of the sand barrel is provided with a sand blocking groove to prevent the
diamond powder from flowing out with the metal wire. The sanding apparatus has the advantages of uniformity in sanding, high content of sands in the sand barrel, compactness in sanding, no shedding, and reduction of the use amount of the diamond
powder.