Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Efficient cooling and dedusting computer shell internal system

A computer and high-efficiency technology, applied in computing, instrumentation, electrical and digital data processing, etc., can solve the problems of over-temperature protection of the host, heating up, and reducing the practicability of the casing, and achieve the effect of improving heat dissipation efficiency and improving practicability.

Active Publication Date: 2018-09-04
聊城大学东昌学院
View PDF7 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the existing computer shell, its heat dissipation effect is half, and when the filter screen is blocked, the internal temperature will rise rapidly, and effective prompting and protection cannot be performed, which will easily cause the over-temperature protection of the host computer and reduce the practicality of the shell. sex

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Efficient cooling and dedusting computer shell internal system
  • Efficient cooling and dedusting computer shell internal system
  • Efficient cooling and dedusting computer shell internal system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The present invention is described in further detail now in conjunction with accompanying drawing. These drawings are all simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, so they only show the configurations related to the present invention.

[0022] like Figure 1-Figure 4 As shown, a computer housing built-in system for high-efficiency heat dissipation and dust removal includes a housing 1, one side of the housing 1 is provided with a heat dissipation hole, and a plurality of heat dissipation fins 2 are arranged at the heat dissipation hole, and each heat dissipation fin 2 is provided with a The first filter screen has a fan 3 inside;

[0023] The inside of the housing 1 is provided with a number of circuit boards 5, and the inside of each circuit board 5 is provided with a heat absorbing pipe 17. The heat absorbing pipe 17 is consistent with the number of the cooling fins 2 and corresponds one b...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an efficient cooling and dedusting computer shell internal system. The system comprises a shell; cooling holes are formed in one side of the shell; multiple cooling fins are arranged at the cooling holes; a first filter net is arranged on the outer side of each cooling fin; a fan is arranged on the inner side of each cooling fin; multiple circuit boards are arranged in theshell; heat absorption pipes are arranged in the circuit boards; an air inlet channel is formed in the upper part of the shell; multiple stages of second filter nets are arranged in the air inlet channel; and the second filter nets are vertically arranged on the air inlet channel. According to the efficient cooling and dedusting computer shell internal system, heat in the circuit boards is absorbed through the heat absorption pipes, and the heat is quickly treated in combination with the cooling fins, so that the cooling efficiency of the shell is improved; in addition, through a limiting component and a prompting component, in combination with a baffle, blockage of the second filter nets can be prompted and protection can be realized, so that the practicality of the shell is further improved; and the system is reasonable in design and suitable for popularization and use.

Description

technical field [0001] The invention relates to the technical field of computer heat dissipation, in particular to a built-in system for efficient heat dissipation and dust removal in computer shells. Background technique [0002] In the existing computer shell, its heat dissipation effect is half, and when the filter screen is blocked, the internal temperature will rise rapidly, and effective prompting and protection cannot be performed, which will easily cause the over-temperature protection of the host computer and reduce the practicality of the shell. sex. Contents of the invention [0003] In order to overcome the above-mentioned deficiencies, the present invention provides a computer housing built-in system for high-efficiency heat dissipation and dust removal. A first filter screen is provided, and a fan is provided inside; [0004] The interior of the housing is provided with a number of circuit boards, and each circuit board is provided with heat-absorbing tubes...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/183G06F1/20
Inventor 王娟满红芳
Owner 聊城大学东昌学院
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com