Chip strip type rigid framework-based chip packaging structure and process thereof

Abstract

The invention discloses a chip strip type rigid framework-based chip packaging structure and a process thereof. The chip packaging structure comprises a rigid framework and a chip packaging substrate;a chip mounting hole is formed in the rigid framework; an adhesive layer is arranged on the chip packaging substrate; the rigid framework is glued with the chip packaging substrate through the adhesive layer; a bare chip is arranged on the chip packaging substrate; the process comprises the steps of performing chip preprocessing, gumming, laminating, residual adhesive removal, bare chip pasting,reflow soldering, plasma cleaning, bottom filling with epoxy resin, and after completion, removing the residual adhesive and performing chip cutting. According to the process, after the rigid framework and the chip packaging substrate are integrally laminated, the bare chip is mounted, and then the integrated body is subjected to slicing and cutting to form each chip packaging unit, so that the warping problem in the conventional resin packaging is solved effectively, heating of the chip is relieved, and the working performance of the chip is improved; and in addition, one-by-one processing ofthe chip packaging units is avoided, so that the processing efficiency and yield of chip packaging are highly improved.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a chip packaging structure and technology based on a strip type rigid frame. Background technique [0002] At present, the assembly of flip-chip products generally has the following forms: single-chip flip-chip array packaging with bottom filling, and can be matched with a single heat sink or cooling ring; strip flip-chip array packaging with bottom filling, and It can be packaged with thermally conductive resin, or strip-shaped flip-chip array package can be directly matched with thermally conductive resin package. [0003] The existing packaging process generally includes the following steps, wafer image quality evaluation, sticking tape, back grinding, wafer placement, sending to laser or mechanical dicing machine for dicing, secondary inspection, and then chip placement and reflow soldering , Plasma cleaning, bottom filling, and residual adhesive removal. After comple...

AI Technical Summary

Problems solved by technology

[0004] In the existing packaging structure and process, the chip is flipped and filled with glue first, and after slicing, each chip packaging unit is assembled with a heat dissipation cover or a heat dissipation ring component, or a heat-conducting resin is packaged; resulting in low processing efficiency, which is not conducive to Mass production of chip packaging

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