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A test structure and method for pcb back-drilling alignment

A technology of testing structure and testing method, applied in the field of PCB manufacturing, can solve the problems of difficult observation, long time-consuming, misjudgment, etc., and achieve the effect of avoiding waste

Active Publication Date: 2021-05-25
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there are defects in this method. It is easy to observe when the back drilling is shallow. If the depth of the back drilling is deep, it is difficult to observe with the naked eye. It is very easy to misjudgment due to unclear observation, or it takes a long time

Method used

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  • A test structure and method for pcb back-drilling alignment
  • A test structure and method for pcb back-drilling alignment
  • A test structure and method for pcb back-drilling alignment

Examples

Experimental program
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Embodiment 1

[0038] This embodiment provides a test structure for the alignment of PCB back-drilling, which is suitable for PCBs that require back-drilling. drill position.

[0039] figure 1 It is a schematic diagram of the test structure of the PCB back-drilling alignment provided in this embodiment. Such as figure 1 As shown, the test structure 5 includes: a plurality of test units 6, the test unit 6 is composed of a drill hole 1 and a plurality of reference holes 2, and the drill hole 1 can be back-drilled to obtain a back-drilled hole 3.

[0040] In one said test unit 6, a plurality of said reference holes 2 are arranged around said one borehole 1, and may be arranged in different directions around a borehole 1, said one borehole 1 is connected with each said reference hole 1. The distance between the centers of the holes 2 is equal, and when the center of the back-drilled hole 3 coincides with the center of a drilled hole 1, the minimum distance from the wall of the back-drilled ho...

Embodiment 2

[0045] This embodiment adopts the test structure provided in the above embodiment, and before back-drilling on the circuit pattern, back-drilling is performed on the test structure to check the alignment of the back-drilling.

[0046] figure 2 It is a flow chart of the method for testing the alignment of PCB back-drilling provided by Embodiment 2 of the present invention. Such as figure 2 As shown, the test method includes the following steps:

[0047] S11, setting a test structure on the PCB.

[0048] Figure 4 It is a schematic diagram of the position of the test structure on the PCB in the second embodiment of the present invention. combine Figure 4 For illustration, a test structure 5 is respectively arranged around the circuit pattern unit 4 as a group of test structures. As a preferred implementation manner, a test structure 5 is respectively provided at the four corners of the line graphic unit 4 .

[0049] At least one set of test structures are respectively ...

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Abstract

The invention discloses a test structure and method for alignment degree of PCB back-drilling, and relates to the manufacturing technology of PCB. The method includes: setting a test structure on the PCB; drilling a drill hole and a reference hole on the test structure; performing back drilling on the drill hole to obtain a back drill hole; through the back drill hole and the described The positional relationship of the reference holes is used to determine the backdrilling alignment. Before the back-drilling on the circuit pattern, the present invention uses the back-drilling on the test structure as a reference, and judges whether the back-drilling is biased through the positional relationship between the back-drilling hole and several reference holes, so as to determine whether normal production is possible. . On the one hand, it is possible to judge whether the hole is biased directly from the surface of the module without zooming in on the hole wall; on the other hand, back-drilling and inspection on the module in advance can avoid waste caused by unqualified back-drilling on the circuit pattern.

Description

technical field [0001] The invention relates to PCB manufacturing technology, in particular to a test structure and method for PCB back-drilling alignment. Background technique [0002] In the production of PCB, the function of back drilling is to drill out the through-hole section that does not play any connection or transmission role, so as to avoid reflection, scattering, delay, etc. of high-speed signal transmission, which will bring "distortion" to the signal. During the back-drilling process, if the back-drill and the first-drill have offset holes, it is very easy to cause the back-drilled part of the hole wall copper to not be completely drilled, resulting in signal transmission distortion. [0003] In the prior art, in order to judge whether the back-drilling is biased, usually after the back-drilling, directly use a 10-fold mirror to observe whether the back-drilling hole in the board is deviated or not. However, there are defects in this method. It is easy to obse...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66
CPCH01L22/30
Inventor 万里鹏刘梦茹纪成光
Owner DONGGUAN SHENGYI ELECTRONICS
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