Double-chip packaging structure
A packaging structure, two-chip technology, applied in the direction of semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of increasing the manufacturing cost and increasing the size of the chip package, avoiding equipment conflicts, low manufacturing costs, and leading The effect of a small number of feet
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[0067] The following content will be combined with drawings to illustrate the technical content of the present invention through specific specific embodiments. Those familiar with this technology can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied by other different specific embodiments. Various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the spirit of the present invention. In particular, the proportional relationship and relative positions of the various components in the drawings are merely exemplary and do not represent the actual implementation of the present invention.
[0068] Please refer to Figure 3A and Figure 3B with Figure 3C ,among them Figure 3A Is a side view of the dual-chip package structure 100 of the first embodiment of the present invention...
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