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Mold

A mold and mold cavity technology, applied in the field of molds, can solve problems such as leakage of resin vent holes

Active Publication Date: 2018-09-14
株式会社PANGEA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this case, the resin is still prone to leaking from the vent hole

Method used

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Experimental program
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Effect test

no. 1 Embodiment approach

[0024] figure 1 It is a plan view illustrating the mold of the first embodiment. figure 2 (A) and figure 2 (B) is a cross-sectional view illustrating the mold and the transfer molding device of the first embodiment. figure 1 From figure 2 (A) Top view viewed from arrow AA. figure 2 (A) is along figure 1 A cross-sectional view of line A1-A2. figure 2 (B) is along figure 1 Sectional view of line B1-B2.

[0025] Such as figure 2 As shown in (A), the mold 10M of this embodiment includes the first mold 10 and the second mold 20 . The main surface 10 a of the first mold 10 is arranged to face the main surface 20 a of the second mold 20 . figure 2 (A) shows an example of a state where two molds are separated from each other. Let the direction from the second die 20 toward the first die 10 be the Z-axis direction as the first direction. Let one direction perpendicular to the Z-axis direction be the X-axis direction. Let the direction perpendicular to the Z-axis dire...

no. 2 Embodiment approach

[0077] Figure 7 (A) and Figure 7 (B) is a partial cross-sectional view illustrating a mold and a transfer molding device according to the second embodiment. exist Figure 7 (A) and Figure 7 In (B), the structure of the mold 10 from the cavity part 10c to 10 d of intermediate cavity parts is shown. In the second embodiment, the sensor 50b is arranged between the sensor 50a and the first opening and closing unit 12a. The sensors 50a and 50b are continuously arranged on the upstream side of the first opening and closing portion 12a. Other configurations of the second embodiment may be the same as the corresponding configurations of the first embodiment.

[0078] Second, refer to Figure 4 The operation of the molding device of the second embodiment will be described.

[0079] The sensors 50a and 50b are not particularly limited, for example, they may be an optical sensor and a pressure sensor, respectively. In this case, until the resin material 40 reaches the intermed...

no. 3 Embodiment approach

[0084] Figure 8 (A)~ Figure 8 (D) is a partial cross-sectional view illustrating a mold and a transfer molding device according to a third embodiment. The mold 10 of the third embodiment differs from the mold 10 of the second embodiment in that it further includes a third opening and closing portion 12c and a sensor 50d. Other configurations of the third embodiment may be the same as those of the second embodiment.

[0085] The configuration and operation of the sensors 50a, 50b, and the first and second opening and closing parts 12a, 12b may be the same as those of the second embodiment. Figure 8 (A) and Figure 8 (B) with Figure 7 (A) and Figure 7 (B) Correspondence.

[0086] Such as Figure 8 (A)~ Figure 8 As shown in (D), the third opening and closing unit 12c is provided between the second opening and closing unit 12b and the suction unit 10e, and opens and closes the discharge path according to the operation of the second opening and closing unit 12b. The ...

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Abstract

A mold is provided, resin can be fully filled into the cavity of the mold, and resin leakage from the vent hole of the mold is inhibited. The mold according to an embodiment includes a first surface to be in contact with a surface of a substrate to be processed. A cavity portion recedes in a first direction being away from the first surface. A vent portion recedes in the first direction and is closer to the first surface than the cavity portion. The vent portion communicates with the cavity portion and serves as a discharge path for gas in the cavity portion. A suction portion recedes in the first direction and is farther from the first surface than the vent portion. The suction portion communicates with the vent portion. A first opening / closing portion is provided between the vent portionand the suction portion, and opens and closes or narrows down the discharge path. A second opening / closing portion is provided between the first opening / closing portion and the suction portion, and opens and closes the discharge path.

Description

[0001] [Related applications] [0002] This application enjoys the priority of the basic application based on Japanese Patent Application No. 2017-40474 (filing date: March 3, 2017). This application includes the entire content of the basic application by referring to this basic application. technical field [0003] Embodiments of the present invention relate to a mold. Background technique [0004] Due to miniaturization and layering of semiconductor devices, etc., gaps through which resin flows when sealing semiconductor devices with resin are narrowed. In order to cope with the narrowing of such a gap, the viscosity of the resin is lowered. However, if the viscosity of the resin is lowered, the resin passes through the cavity of the mold in a short time and reaches the degassing hole. Therefore, if the venting in the cavity of the mold is continued immediately before the filling of the resin is completed, the resin will leak from the vent hole. [0005] Also, if the v...

Claims

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Application Information

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IPC IPC(8): B29C45/34
CPCB29C45/34B29C45/14655H01L21/565H01L24/16H01L2224/16227H01L21/67126H01L2924/181
Inventor 前田竹识松嶋良二南中理岩政直树
Owner 株式会社PANGEA
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