A quantum dot light-emitting diode device and its preparation method
A quantum dot light-emitting and diode technology, which is applied in the field of quantum dots, can solve the problems of short service life and low light extraction efficiency, and achieve the effects of avoiding oxidation and corrosion, increasing light extraction efficiency, and prolonging service life
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Embodiment 1
[0051] use as figure 1 The ITO glass shown (the size of the glass is 2cm×2cm×2mm, Φ=90°, the groove size is 1.5cm×1.5cm×1mm) is placed in the detergent solution, the surface is cleaned with a brush, and then placed Clean with ultrasonic vibration in isopropanol for 20 minutes, then rinse the glass surface with ultra-pure water, then put it into a beaker of ultra-pure water for 10 minutes, wash it with N 2 The air gun dries the glass.
[0052] according to image 3 The film is coated on the glass as shown, and the SiNx film (insulation layer) is deposited by plasma chemical vapor emission (PECVD) in the area without film, and then the film is cleaned with an organic solvent; PECVD deposition process parameters: RF source frequency 13.56MHz , the deposition temperature is 200°C, the RF power is 150W, the working pressure is 133Pa, and the gas source is silane (SiH 4 ) and ammonia (NH 3 ) flow ratio=10sccm:90sccm, protective gas argon (Ar), flow rate 100sccm, deposition time ...
Embodiment 2
[0056] use as figure 2 The ITO glass shown (the glass size is 2cm×2cm×2mm, Φ=120°, the groove size is 1.5cm×1.5cm×1mm), placed in the detergent solution, brushed the surface with a brush, and then placed Clean with ultrasonic vibration in isopropanol for 20 minutes, then rinse the glass surface with ultra-pure water, then put it into a beaker of ultra-pure water for 10 minutes, wash it with N 2 The air gun dries the glass.
[0057] according to image 3 The film is coated on the glass as shown, and the SiNx film (insulation layer) is deposited by plasma chemical vapor emission (PECVD) in the area without film, and then the film is cleaned with an organic solvent; PECVD deposition process parameters: RF source frequency 13.56MHz , the deposition temperature is 200°C, the RF power is 150W, the working pressure is 133Pa, and the gas source is silane (SiH 4 ) and ammonia (NH 3 ) flow ratio=10sccm:90sccm, protective gas argon (Ar), flow rate 100sccm, deposition time 5min.
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