A Microstructure Energy Recovery Speed Bump Based on Piezoelectric Effect
A technology of energy recovery and piezoelectric effect, applied in the direction of piezoelectric effect/electrostrictive or magnetostrictive motors, electrical components, generators/motors, etc., can solve low efficiency, complex structure and underground layout, energy recovery Problems such as large size of the device
Inactive Publication Date: 2020-07-17
JILIN UNIV
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Problems solved by technology
[0006] In view of the problems existing in the existing technology such as complex structure and underground layout, poor vibration and noise attenuation, and large volume and low efficiency of energy recovery devices
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[0026] like Figure 1-9 Shown: A specific embodiment of the present invention provides a microstructure energy recovery speed bump based on the piezoelectric effect, the speed bump includes a speed bump body 2, a microstructure filling part 3, a high-strength rubber block 5, a cantilever beam pressure Electric vibrator 6, energy recovery circuit 11; the section of the deceleration belt body 2 is trapezoidal, symmetrical on both sides, divided into upper and lower surfaces and slope surfaces, and the skins of the upper and lower surfaces and slope surfaces are made of ordinary rubber with cost advantages; The internal microstructure filling part 3 of the speed bump body 2 is evenly filled between the upper and lower surfaces, and is connected with the upper and lower surfaces and the slope surface by bonding. 6, the microstructure filling components 3 are properly sparsely distributed.
[0027] The microstructure filling part 3 is composed of X-shaped concave microstructure ce...
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The invention provides a microstructure energy recovery speed bump based on the piezoelectric effect, which comprises a speed bump body, a microstructure filling component, a high-strength rubber block, a piezoelectric cantileverand an energy capture circuit.The speed bump body is in a trapezoidal shape, wherein the microstructure filling component, the high-strength rubber block, thepiezoelectriccantilever and theenergy capture circuit are arranged inside the speed bump body.The microstructure filling component is composed of an X-shaped concave microstructure cell arranged in a three-dimensional lattice; thehigh-strength rubber block is arranged at the slope surface of the speed bump body for fixing the speedbumpand the piezoelectric cantilever on the ground.The piezoelectric cantilevercomprises thecentralelastic polar plates, thepiezoelectric sheets on both sides anda centralized mass blockat the front end, wherein the piezoelectric sheetsareconnected to form a piezoelectricbimorph structure on the central elastic polar platesand areconnected in parallel by wires.Inpractical applications, the piezoelectric cantilever is distributed evenlyin the longitudinal direction of the speed bump and connected in parallel. The energy capture circuit is embedded in the high-strength rubber block.
Description
technical field [0001] The invention belongs to the technical field of road traffic safety facilities, and more specifically relates to a piezoelectric effect-based microstructure energy recovery speed bump. Background technique [0002] The speed bump is a new type of traffic-specific safety device that is slightly raised on the road surface to achieve vehicle deceleration. It is generally installed in highway toll stations, schools, residential quarters, and entrances to industrial and mining enterprises that require vehicles to slow down and where traffic accidents are prone to occur. . With the continuous improvement of people's living standards and the continuous increase of car ownership, traffic safety problems have become increasingly serious, and the existence of speed bumps has largely reduced the occurrence of accidents at major traffic intersections. [0003] Existing speed bumps, including cement bosses, steel and rubber, etc., although they are widely used in ...
Claims
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IPC IPC(8): E01F9/529H02N2/18
CPCE01F9/529H02N2/18H02N2/186
Inventor 马芳武王国旺梁鸿宇王佳伟蒲永锋
Owner JILIN UNIV