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Heat dissipation device structure

A technology of radiator and cooling fins, applied in heat exchange equipment, lighting and heating equipment, cooling/heating device for lighting devices, etc.

Pending Publication Date: 2018-09-21
黄山谷捷股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is the structure of the radiator, which solves the problem of existing car aluminum parts and brazing parts. The heat dissipation substrate and the heat sink are riveted or brazed together after car processing, and there must be a gap between them; resulting in indirect Thermal resistance. At the same time, the thermal expansion and contraction during the use of the lamp will also cause the gap to be generated and become larger, which will increase the thermal resistance, which is not conducive to the problem of heat conduction.

Method used

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Examples

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Embodiment Construction

[0016] Examples such as figure 1 , figure 2 The heat sink structure shown includes a base plate 1, a heat dissipation fin group 2 formed on the base plate 1, the heat dissipation fin set 2 and the base plate 1 are integrally cold forged and extruded, and the base plate 1 is also integrally cold forged and extruded to be used for The glue-filling groove 3 for fixing PCB wires is provided with a wire passing hole 4 at the bottom of the glue-filling groove 3; a semicircular notch 5 for installation and positioning is provided on one side of the bottom plate 1.

[0017] The cooling fin group 2 is arranged on the left end of the front of the bottom plate 1 , the glue filling groove 3 is arranged on the right end of the front of the bottom plate 1 , and the semicircular notch is arranged on the left side wall of the bottom plate 1 . The back of the bottom plate 1 is integrally cold-forged and extruded to form a circuit board installation table 6, and a sealing ring installation gr...

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Abstract

The invention discloses a heat dissipation device structure. The heat dissipation device structure comprises a bottom plate and heat dissipation fin groups molded on the bottom plate; the heat dissipation fin groups and the bottom plate are integrally molded by cold forging and extrusion; a glue pouring groove used for fixing a PCB lead wire is also integrally molded on the bottom plate by cold forging and extrusion; wire through holes are formed in the bottom of the glue pouring groove; a semi-circular notch used for mounting and positioning is formed in one side of the bottom plate. The heatdissipation device structure can effectively solve the problems that gaps are generated between the heat dissipation substrates and the heat dissipation fins when the heat dissipation substrates andthe heat dissipation fins of the existing lathed aluminum parts and braze parts are lathed and are subsequently riveted or brazed together, the indirect heat resistance is generated, meanwhile, the gaps are also generated and enlarged because of expansion caused by heat and contraction caused by cold of lamps in the using process, the heat resistance is more possibly increased, and the disadvantage is brought to the conduction of the heat.

Description

technical field [0001] The invention relates to a radiator structure. Background technique [0002] Existing car aluminum parts and brazing parts, the heat dissipation substrate and the heat sink are riveted or brazed together after turning, and there must be a gap between them; indirect thermal resistance is generated, and the heat dissipation during the use of the lamp Expansion and contraction will also lead to the generation and enlargement of the gap, which will increase the thermal resistance, which is not conducive to heat conduction. Contents of the invention [0003] The purpose of the present invention is the structure of the radiator, which solves the problem of existing car aluminum parts and brazing parts. The heat dissipation substrate and the heat sink are riveted or brazed together after car processing, and there must be a gap between them; resulting in indirect Thermal resistance. At the same time, thermal expansion and contraction during the use of lamps...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/74F21V29/89B21D53/04B21D39/00
CPCF21V29/74F21V29/89B21D39/00B21D53/04
Inventor 罗仁棠
Owner 黄山谷捷股份有限公司
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