Heat dissipation device structure
A technology of radiator and cooling fins, applied in heat exchange equipment, lighting and heating equipment, cooling/heating device for lighting devices, etc.
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[0016] Examples such as figure 1 , figure 2 The heat sink structure shown includes a base plate 1, a heat dissipation fin group 2 formed on the base plate 1, the heat dissipation fin set 2 and the base plate 1 are integrally cold forged and extruded, and the base plate 1 is also integrally cold forged and extruded to be used for The glue-filling groove 3 for fixing PCB wires is provided with a wire passing hole 4 at the bottom of the glue-filling groove 3; a semicircular notch 5 for installation and positioning is provided on one side of the bottom plate 1.
[0017] The cooling fin group 2 is arranged on the left end of the front of the bottom plate 1 , the glue filling groove 3 is arranged on the right end of the front of the bottom plate 1 , and the semicircular notch is arranged on the left side wall of the bottom plate 1 . The back of the bottom plate 1 is integrally cold-forged and extruded to form a circuit board installation table 6, and a sealing ring installation gr...
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