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Preparation method of array substrate, array substrate and display device

A technology for array substrates and substrates, which is used in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., and can solve problems such as signal crosstalk

Inactive Publication Date: 2018-09-28
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The present invention provides a preparation method of an array substrate, an array substrate and a display device to solve the problem of signal crosstalk between adjacent pixels

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  • Preparation method of array substrate, array substrate and display device
  • Preparation method of array substrate, array substrate and display device
  • Preparation method of array substrate, array substrate and display device

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Embodiment Construction

[0033] In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0034] A pixel unit on an array substrate in the prior art is generally composed of a red sub-pixel R, a green sub-pixel G and a blue sub-pixel B. Due to the overlapping of organic light-emitting layers between adjacent pixels, there is signal crosstalk between adjacent sub-pixels, that is, when the green sub-pixel G is lit, carriers flow into the red sub-pixel R through the organic light-emitting layer, resulting in red sub-pixel R Also glows faintly, as figure 1 As shown, it affects the display effect of the product, and this problem is especially serious under low gray scale display.

[0035] In order to solve the problem of signal crosstalk between adjacent pixels, an embodiment of the present application provides an array su...

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Abstract

The application provides a preparation method of an array substrate, the array substrate and a display device. The array substrate comprises organic light-emitting layers formed on an anode layer anda pixel defining layer, and a current partition part formed on the pixel defining layer and located between the organic light-emitting layers of the adjacent pixel regions, wherein the current partition part is used for partitioning the carrier movement between the organic light-emitting layers of the adjacent pixel regions. The transverse movement of the current between adjacent pixels is avoidedby arranging the current partition part, and the signal crosstalking between the adjacent pixels is interrupted.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a method for preparing an array substrate, the array substrate and a display device. Background technique [0002] As application products require high resolution, current products are developing toward high PPI (pixels per inch: the number of pixels per inch). However, as the PPI increases, the distance between adjacent pixels becomes smaller and smaller. During the evaporation process of the organic light-emitting layer, the shadow shadow effect caused by the edge of the mask and the alignment shift of the mask will cause phase shifts. The overlapping of organic light-emitting layers between adjacent pixels causes lateral movement of current on the organic light-emitting layer, resulting in signal crosstalk between adjacent pixels, especially at low gray levels, the impact of signal crosstalk between adjacent pixels on display effects is more obvious , seriously affec...

Claims

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Application Information

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IPC IPC(8): H01L27/32H01L51/56H01L27/12
CPCH01L27/1259H10K59/121H10K59/122H10K71/00
Inventor 杨婷雁何传友马群
Owner BOE TECH GRP CO LTD