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A kind of polyimide carrier adhesive film and preparation method thereof

A technology of polyimide and polyimide resin, which is applied in the field of polyimide carrier film and its preparation, can solve the problems of easy debonding and inconsistent thermal expansion coefficient, so as to alleviate relative motion and increase adhesion The effect of intensity

Active Publication Date: 2019-09-13
AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the high curing temperature of carbon fiber reinforced polyimide composite materials, which is about 400 °C, the thermal expansion coefficients of the metal structure and the composite material structure are inconsistent during the curing and cooling process, and debonding is easy to occur during the cooling process. At the same time, polyimide The curing and use temperature of the composite material is high. The higher the temperature, the greater the difference in thermal expansion between the two materials. The traditional epoxy and bima resin film is no longer suitable for high temperature systems. At the curing temperature of polyimide, the film has already Carbonization decomposition, so it is urgent to develop an interface layer suitable for carbon fiber reinforced polyimide composite materials and metal structures to solve the interface matching and bonding problems between high-temperature curing resin-based composite materials and metal structures

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Add 100 parts of YH-550 polyimide and 10 parts of Vespel thermoplastic polyimide to 250 parts of N,N-dimethylacetamide (DMAC) (boiling point 166°C), stir at 115°C for 3 hours, and wait to mix After uniform and complete dissolution, then add 1 part of polystyrene oligomer (thermal decomposition temperature 325°C) and ultrasonically mix evenly to prepare a surface density of 30g / m 2 Chopped carbon fiber mat, use the solution method to coat the prepared glue on the chopped carbon fiber mat according to the predetermined thickness on both sides, heat it at 60℃h for 0.5h, attach the isolation film, and make a film with a thickness of 0.1mm . Use this adhesive film to bond 45# steel sheet, press 240°C / 2h+370°C / 3h, hot press curing under 3MPa pressure conditions, according to GB / T 7122-1996 peel strength test method and GB / T 7124-1986 shear The strength test method is to test the peel strength and shear strength at room temperature and 400°C respectively. The shear strength a...

Embodiment 2

[0037] Add 100 parts of YH-550 polyimide and 20 parts of Vespel thermoplastic polyimide to 250 parts of N,N-dimethylacetamide (DMAC), stir at 115°C for 3 hours, and wait until the mixture is uniform and completely dissolved. Then add 1 part of polystyrene oligomer and ultrasonically mix evenly to prepare a surface density of 30g / m 2 Chopped carbon fiber mat, use the solution method to coat the prepared glue on the chopped carbon fiber mat according to the predetermined thickness on both sides, heat it at 60℃h for 0.5h, attach the isolation film, and make a film with a thickness of 0.1mm . Use this adhesive film to bond 45# steel sheet, press 240°C / 2h+370°C / 3h, hot press curing under 3MPa pressure conditions, according to GB / T 7122-1996 peel strength test method and GB / T 7124-1986 shear The strength test method is to test the peel strength and shear strength at room temperature and 400°C respectively. The shear strength at room temperature is 12.49MPa, the peel strength is 1.9...

Embodiment 3

[0039] Except for 3 parts of polystyrene oligomers, the rest are consistent with Example 2, and the film is obtained. The peel strength and shear strength are tested at room temperature and 400°C respectively. The shear strength at room temperature is 10.73MPa, and the peel strength is 1.37KN / m, the high temperature 400°C shear strength is 4.63MPa, and the peel strength is 0.57KN / m.

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PUM

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Abstract

The invention provides a polyimide carrier adhesive film and a preparing method thereof. The adhesive film is prepared from a mixed adhesive solution and a fiber carrier by adopting a solution method.The mixed adhesive solution includes thermoset polyimide resin, thermoplastic polyimide resin, thermally unstable oligomer and a solvent having a high boiling point, and the fiber carrier is short cut fibrofelt. The adhesive film is designed based on double functions of adhesive bonding and thermal stress buffer, in-situ foaming is realized under high solidification temperature by the adhesive film, the good adhesive bonding of a metal structure and a composite material can be realized by the high-toughness high toughness of the adhesive film, the peeling strength is improved, and the potential corrosion can be avoided at the same time.

Description

technical field [0001] The invention relates to a polyimide carrier adhesive film and a preparation method thereof, belonging to the technical field of composite materials. Background technique [0002] With the rapid development of aerospace technology, missiles and aircraft are developing in the direction of high speed, long-distance, and structural and functional integration. The flight speed of missiles and aircraft can reach Ma3-4, and some even break through Ma6. The problem of aerodynamic heating makes the projectile structure face an increasingly harsh working environment. The high temperature environment also limits the application of many commonly used subsonic projectile structural materials such as aluminum alloy and epoxy composite materials. In order to further adapt to the large load of the aircraft Due to the multiple requirements of ammunition volume and long range of missiles, the structure of the missile body needs to be further reduced in weight. Polyimi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/00
Inventor 柯红军许亚洪王国勇
Owner AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH