A kind of high temperature resistant carrier adhesive film and preparation method thereof
A high temperature resistant, carrier technology, applied in chemical instruments and methods, adhesives, synthetic resin layered products, etc., can solve the problems of performance degradation, insufficient temperature resistance, unable to form interface matching and good bonding, etc., to alleviate the relative Movement, the effect of increasing bond strength
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0036] Add 100 parts of YH-550 polyimide and 20 parts of Vespel thermoplastic polyimide to 250 parts of N,N-dimethylacetamide (DMAC) (boiling point 166°C), stir at 115°C for 3 hours, and wait to mix After uniform and complete dissolution, then add 1 part of polystyrene oligomer (thermal decomposition temperature 325°C) and ultrasonically mix evenly to prepare a surface density of 30g / m 2 Chopped carbon fiber mat, use the solution method to coat the prepared glue on the chopped carbon fiber mat according to the predetermined thickness on both sides, heat it at 60℃h for 0.5h, attach the isolation film, and make a film with a thickness of 0.1mm . Use this adhesive film to bond 45# steel sheet, press 240°C / 2h+370°C / 3h, hot press curing under 3MPa pressure conditions, according to GB / T 7122-1996 peel strength test method and GB / T 7124-1986 shear The strength test method is to test the peel strength and shear strength at room temperature and 400°C respectively. The shear strength a...
Embodiment 2
[0038] Add 100 parts of 5428 bismaleimide (BMI) and 20 parts of thermoplastic polyethersulfone to 250 parts of dioxane (boiling point 101.5°C), stir at 55°C for 3 hours, wait until the mixture is uniform and completely dissolved, then add 5 parts of polyethylene oligomer (thermal decomposition temperature 142°C) are ultrasonically mixed uniformly, and the prepared area density is 30g / m 2 For chopped carbon fiber felt, the prepared glue solution is coated on the fiber carrier according to the predetermined thickness by the solution method, baked at 60°C for 0.5h, and the isolation film is attached to make an interface layer with a thickness of 0.1mm. Use this adhesive film to bond 45# steel sheet, press 180°C / 2h+200°C / 3h, hot press curing under 3MPa pressure conditions, according to GB / T7122-1996 peel strength test method and GB / T 7124-1986 shear strength The test method is to test the peel strength and shear strength at room temperature and 250°C respectively. The shear streng...
Embodiment 3
[0040] Add 100 parts of Novolac type cyanate ester and 20 parts of thermoplastic polyether ether ketone into 250 parts of dimethylformamide (DMF) (boiling point 152°C), stir at 110°C for 3 hours, wait until the mixture is uniform and completely dissolved, then add 1 part of polypropylene oxide oligomer (thermal decomposition temperature 200°C) is ultrasonically mixed, and the prepared area density is 30g / m 2 Chopped carbon fiber felt, using the solution method to coat the prepared glue solution on the fiber carrier according to the predetermined thickness, heat it at 60°C for 0.5h, attach the isolation film, and make a glue film with a thickness of 0.1mm. Use this adhesive film to bond 45# steel sheet, press 240°C / 2h+300°C / 3h, hot press curing under 3MPa pressure conditions, according to GB / T 7122-1996 peel strength test method and GB / T 7124-1986 shear The strength test method is to test the peel strength and shear strength at room temperature and 300°C respectively. The shear...
PUM
| Property | Measurement | Unit |
|---|---|---|
| boiling point | aaaaa | aaaaa |
| boiling point | aaaaa | aaaaa |
| shear strength | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More