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A kind of polyimide adhesive film and preparation method thereof

A technology of polyimide film and polyimide resin, which is applied in the field of composite materials, can solve problems such as easy debonding and inconsistent thermal expansion coefficients, and achieve the effect of alleviating relative movement and increasing bond strength

Active Publication Date: 2019-09-13
AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the high curing temperature of carbon fiber reinforced polyimide composite materials, which is about 400 °C, the thermal expansion coefficients of the metal structure and the composite material structure are inconsistent during the curing and cooling process, and debonding is easy to occur during the cooling process. At the same time, polyimide The curing and use temperature of the composite material is high. The higher the temperature, the greater the difference in thermal expansion between the two materials. The traditional epoxy and bima resin film is no longer suitable for high temperature systems. At the curing temperature of polyimide, the film has already Carbonization decomposition, so it is urgent to develop an interface layer suitable for carbon fiber reinforced polyimide composite materials and metal structures to solve the interface matching and bonding problems between high-temperature curing resin-based composite materials and metal structures

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Add 100 parts of YH-550 polyimide and 10 parts of Vespel thermoplastic polyimide to 250 parts of N,N-dimethylacetamide (DMAC) (boiling point 166°C), stir at 115°C for 3 hours, and wait to mix After uniform and complete dissolution, then add 1 part of polystyrene oligomer (thermal decomposition temperature 325°C) and 0.1 part of chopped carbon fiber with a length of 50 microns and ultrasonically mix evenly, and use the solution method to apply the prepared glue according to the predetermined thickness. Cover it on segregation paper, bake it at 60°Ch for 0.5h, attach a separator, and make a film with a thickness of 0.1mm. Use this adhesive film to bond 45# steel sheet, press 240°C / 2h+370°C / 3h, hot press curing under 3MPa pressure conditions, according to GB / T7122-1996 peel strength test method and GB / T 7124-1986 shear strength The test method is to test the peel strength and shear strength at room temperature and 400°C respectively. The shear strength at room temperature ...

Embodiment 2

[0036] Add 100 parts of YH-550 polyimide and 20 parts of Vespel thermoplastic polyimide to 250 parts of N,N-dimethylacetamide (DMAC), stir at 115°C for 3 hours, and wait until the mixture is uniform and completely dissolved. Then add 1 part of polystyrene oligomer and 0.1 part of chopped carbon fiber with a length of 50 microns and ultrasonically mix them evenly, and use the solution method to coat the prepared glue on the segregation paper according to the predetermined thickness, and heat it at 60 ° C h 0.5h, attach the isolation film to make a film with a thickness of 0.1mm. Use this adhesive film to bond 45# steel sheet, press 240°C / 2h+370°C / 3h, hot press curing under 3MPa pressure conditions, according to GB / T 7122-1996 peel strength test method and GB / T7124-1986 shear strength The test method is to test the peel strength and shear strength at room temperature and 400°C respectively. The shear strength at room temperature is 12.46MPa, the peel strength is 1.95KN / m, and th...

Embodiment 3

[0038] Except that the polystyrene oligomer is 3 parts, the others are consistent with Example 2 to obtain the adhesive film, and test the peel strength and shear strength at room temperature and 400°C respectively. The shear strength at room temperature is 10.75MPa, and the peel strength is 1.35KN / m, the high temperature 400°C shear strength is 4.65MPa, and the peel strength is 0.55KN / m.

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PUM

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Abstract

Polyimide adhesive film and a preparing method thereof are disclosed. High-temperature resistant thermosetting polyimide and thermoplastic polyimide having excellent toughness are mixed, micro-nano chopped fibers and a heat-liable oligomer are added into the mixture and fully mixed in a solvent, and the adhesive film having a certain thickness is prepared by adopting a solution process. Based on adesign of double functions, namely adhesion and thermal stress buffering, the adhesive film can achieve in-situ foaming at a high curing temperature on the one hand, and on the other hand the adhesive film has high toughness so that composite materials and metal structures can be adhered well, peeling strength can be improved and potential corrosion can be avoided.

Description

technical field [0001] The invention relates to a polyimide film and a preparation method thereof, belonging to the technical field of composite materials. Background technique [0002] With the rapid development of aerospace technology, missiles and aircraft are developing in the direction of high speed, long-distance, and structural and functional integration. The flight speed of missiles and aircraft can reach Ma3-4, and some even break through Ma6. The problem of aerodynamic heating makes the projectile structure face an increasingly harsh working environment. The high temperature environment also limits the application of many commonly used subsonic projectile structural materials such as aluminum alloy and epoxy composite materials. In order to further adapt to the large load of the aircraft Due to the multiple requirements of ammunition volume and long range of missiles, the structure of the missile body needs to be further reduced in weight. Polyimide is one of the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/00
Inventor 柯红军许亚洪夏雨李丽英王国勇许孔力
Owner AEROSPACE INST OF ADVANCED MATERIALS & PROCESSING TECH