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A fingerprint module assembly method for improving the gap

A technology of fingerprint modules and assembly methods, which can be applied to character and pattern recognition, instruments, computer parts, etc., and can solve problems such as gap reduction

Active Publication Date: 2021-06-08
蚌埠华特科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a fingerprint module assembly method that improves the gap, so that the gap between the fingerprint recognition chip and the metal ring can be effectively reduced, and the problem that one side of the gap is larger and the other is smaller will not appear.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A method for assembling a fingerprint module for improving gaps, comprising the following steps:

[0022] (1) The fingerprint identification chip is packaged on the PCB board through SMT technology;

[0023] (2) Wrap the side of the fingerprint chip assembled in step (1) with an elastic material, put it in a baking machine and bake it at 110°C for 1 hour;

[0024] (3) Dot underfill glue on the bottom of the metal ring and perform defoaming baking. The baking temperature is 120°C and the time is 3 hours. After baking, dot conductive silver glue and structural glue on the side of the metal ring, and bake again. The temperature is 80°C, and the time is 30 minutes;

[0025] (4) Paste the metal ring after dispensing on the elastic material described in step (2), and bake at a constant pressure of 0.28MPA and 160°C for 2 hours;

[0026] (5) Dot structural glue on the cover plate, and attach the cover plate to the fingerprint identification chip;

[0027] (6) Glue a reinfor...

Embodiment 2

[0032] A method for assembling a fingerprint module for improving gaps, comprising the following steps:

[0033] (1) The fingerprint identification chip is packaged on the PCB board through SMT technology;

[0034] (2) Wrap the side of the fingerprint chip assembled in step (1) with an elastic material, put it into a baking machine and bake at 120°C for 2 hours;

[0035] (3) Dot underfill glue on the bottom of the metal ring and perform defoaming baking. The baking temperature is 130°C and the time is 4 hours. After baking, dot conductive silver glue and structural glue on the side of the metal ring, and bake again. The temperature is 90°C, and the time is 30 minutes;

[0036] (4) Paste the metal ring after dispensing on the elastic material described in step (2), and bake at a constant pressure of 0.3MPA and 150°C for 3 hours;

[0037] (5) Dot structural glue on the cover plate, and attach the cover plate to the fingerprint identification chip;

[0038] (6) Glue a reinforc...

Embodiment 3

[0043] A method for assembling a fingerprint module for improving gaps, comprising the following steps:

[0044] (1) The fingerprint identification chip is packaged on the PCB board through SMT technology;

[0045] (2) Wrap the side of the fingerprint chip assembled in step (1) with an elastic material, put it in a baking machine and bake it at 130°C for 1 hour;

[0046] (3) Dot underfill glue on the bottom of the metal ring and perform defoaming baking. The baking temperature is 140°C and the time is 3 hours. After baking, dot conductive silver glue and structural glue on the side of the metal ring, and bake again. The temperature is 85°C, and the time is 30 minutes;

[0047](4) Paste the metal ring after dispensing on the elastic material described in step (2), and bake at a constant pressure of 0.25MPA and 170°C for 2 hours;

[0048] (5) Dot structural glue on the cover plate, and attach the cover plate to the fingerprint identification chip;

[0049] (6) Glue a reinforc...

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PUM

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Abstract

The invention discloses a fingerprint module assembly method for improving gaps, and relates to the field of fingerprint modules; it comprises the following steps: (1) packaging a fingerprint identification chip on a PCB board through SMT technology; Wrap the material and put it into the baking machine to bake; (3) Dot underfill glue on the bottom of the metal ring and perform defoaming baking. After baking, dot conductive silver glue and structural glue on the side of the metal ring, and bake again; (4) ) bonding the metal ring after dispensing on the elastic material described in step (2), and baking at a constant pressure; (5) pointing structural glue on the cover plate, and bonding the cover plate on the fingerprint identification chip; (6) ) below the PCB board with glue to stick the reinforcing plate to make the fingerprint module; the cover plate is bonded after the metal ring is bonded, which can better control the gap between the cover plate and the metal ring to avoid It solves the problem in the prior art that the gap between the cover plate and the metal ring is large on one side and small on the other.

Description

Technical field: [0001] The invention relates to the field of fingerprint modules, in particular to a fingerprint module assembly method for improving gaps. Background technique: [0002] The fingerprint module is the core component of the fingerprint lock, which is installed on devices such as fingerprint access control or hard disk, and is used to complete the collection of fingerprints and the identification of fingerprints. [0003] The fingerprint identification system collects, analyzes and compares living fingerprints through special photoelectric conversion equipment and computer image processing technology, and can quickly and accurately identify personal identities. The system generally mainly includes processes such as fingerprint image collection, fingerprint image processing, feature extraction, comparison and matching of feature values. Modern electronic integrated manufacturing technology makes fingerprint image reading and processing equipment miniaturized. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K9/00C08L9/06C08L83/04C08L47/00C08K13/02C08K5/07C08K3/26C08K3/22C08K5/09
CPCC08L9/06C08L47/00C08K2003/265C08K2003/2244C08L2205/03G06V40/13C08L83/04C08K13/02C08K5/07C08K3/26C08K3/22C08K5/09
Inventor 来伟晁雷雷
Owner 蚌埠华特科技有限公司
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