37results about How to "Control gap" patented technology

Provided is a manufacturing method of an electronic parts module which can reliably shield electronic parts and implement a compact size. An assembly board (10) forming a plurality of electronic parts modules (1) from a plurality of electronic parts (12,13) is sealed as a whole by resin. Notches (17) are formed from the top surface of the sealed sealing resin layer (14) at the boundaries of the electronic parts modules (1) to positions which reach the ground electrode (16) provided inside of the assembly board (10). After a conductive resin (18) sheet is positioned to cover the notches (17) and the top surface, the conductive resin (18) fills in the notches (17) and connects to the ground electrode (16) by applying pressure and heating the assembly board (10) with the conductive resin (18) sheet placed thereon.

The invention discloses a preparation method of a Fe3O4-Co3O4 porous magnetic composite material. The preparation method comprises the following steps of (a) blending, (b) heating, (c) drying and (d) calcining. In comparison with the prior art, the invention has the following advantages: (1) other oxides are not found in the product, and the product is a heterogeneous material and has uniform particle size, special morphology, high activity, simple one-step synthesis method, large apparent density, and good magnetic performance; (2) the method has high yield, low cost, short production flow and is convenient in scale-up experiment; (3) the method is simple and controllable, and has low demand for equipment, so that the method is suitable for industrial production; and (4) the magnetic material with a heterogeneous oxide core-shell structure provided by the invention can be effectively applied to lithium-ion and fuel cell materials.

The invention provides a method for constructing a special-shaped template of a comprehensive pipe gallery. The method comprises the following steps that 1, according to the construction drawing, modeling design on the special-shaped template is carried out, the size of a standard section is determined and a manufacturing material is selected; 2, the size of a fixed template is determined and thenbent according to the angle requirement of a special-shaped part of the comprehensive pipe gallery, then a spliced template is processed according to the size of the fixed template, and finally the spliced template is spliced and fixed to the fixed template to form the special-shaped template; 3, the special-shaped template is integrally arranged at the special-shaped part of the comprehensive pipe gallery, and a supporting frame is built in the fixed template for reinforcing the special-shaped template; and 4, after the special-shaped template is fixed, concrete pouring is carried out on thespecial-shaped part of the comprehensive pipe gallery, the special-shaped template is disassembled after pouring is completed, and the special-shaped template is pushed and conveyed to the next construction section for further construction. According to the method for constructing the special-shaped template of the comprehensive pipe gallery, the difficulty of installation of the special-shaped template in the construction process is lowered, and the time required for the installation of the special-shaped template in the construction process is shortened.

The invention discloses a manufacturing method of a thinned fingerprint module with strong adhesion, and relates to the field of fingerprint modules; it comprises the following steps: (1) packaging a fingerprint recognition chip on a PCB board through SMT technology; (2) packaging the fingerprint recognition chip on a PCB board; The side of the fingerprint chip is wrapped with elastic material; (3) laser square patterns on the bottom of the metal ring, apply underfill glue and perform defoaming baking, after baking, apply conductive silver glue and structural glue on the side of the metal ring for secondary baking; (4) Attach the processed metal ring to the elastic material and bake at constant pressure; (5) Lay the square pattern on the bottom of the PCB board and the upper part of the reinforcement board with structural glue and bake; (6) Dot structural glue on the cover plate, attach the cover plate on the fingerprint identification chip, and make the thinned fingerprint module with strong adhesion; the fingerprint module made by the present invention has a thinner thickness, and the metal ring The gap between the chip and the chip is more uniform and the gap becomes smaller.

The invention discloses a fingerprint module assembly method for improving gaps, and relates to the field of fingerprint modules; it comprises the following steps: (1) packaging a fingerprint identification chip on a PCB board through SMT technology; Wrap the material and put it into the baking machine to bake; (3) Dot underfill glue on the bottom of the metal ring and perform defoaming baking. After baking, dot conductive silver glue and structural glue on the side of the metal ring, and bake again; (4) ) bonding the metal ring after dispensing on the elastic material described in step (2), and baking at a constant pressure; (5) pointing structural glue on the cover plate, and bonding the cover plate on the fingerprint identification chip; (6) ) below the PCB board with glue to stick the reinforcing plate to make the fingerprint module; the cover plate is bonded after the metal ring is bonded, which can better control the gap between the cover plate and the metal ring to avoid It solves the problem in the prior art that the gap between the cover plate and the metal ring is large on one side and small on the other.