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A kind of manufacturing method of thinning fingerprint module with strong adhesion

A technology of fingerprint module and manufacturing method, which is applied in the direction of acquiring/arranging fingerprints/palmprints, character and pattern recognition, instruments, etc. It can solve the problems of thick thickness, affecting appearance and use, and low user experience satisfaction, and achieve overall Thinner thickness, narrower slit width, and improved adhesion

Active Publication Date: 2021-06-08
蚌埠华特科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the current fingerprint module assembly, the metal ring is glued to the fingerprint chip after the glass cover is attached. This operation makes the metal ring prone to displacement during pressure-baking, resulting in a gap between the metal ring and the chip. One side is big and the other is small, which seriously affects the appearance and use, resulting in low user experience satisfaction, and the thickness is too thick, which limits the wide application of fingerprint modules

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A method for making a thinning fingerprint module with strong adhesion, comprising the following steps:

[0026] (1) The fingerprint identification chip is packaged on the PCB board through SMT technology;

[0027] (2) Wrap the side of the fingerprint chip assembled in step (1) with an elastic material, put it in a baking machine and bake it at 110°C for 1 hour;

[0028] (3) Laser the square pattern on the bottom of the metal ring. After the laser pattern, apply underfill glue and perform defoaming baking. After baking, apply conductive silver glue and structural glue on the side of the metal ring, and then perform secondary baking;

[0029] (4) bonding the metal ring processed in step (3) on the elastic material described in step (2), and baking at a constant pressure;

[0030] (5) For the laser square pattern on the bottom of the PCB board and the upper part of the reinforcement board, apply structural glue to fit, bake;

[0031] (6) Dot structural glue on the cover...

Embodiment 2

[0039] A method for making a thinning fingerprint module with strong adhesion, comprising the following steps:

[0040] (1) The fingerprint identification chip is packaged on the PCB board through SMT technology;

[0041] (2) Wrap the side of the fingerprint chip assembled in step (1) with an elastic material, put it into a baking machine and bake at 120°C for 2 hours;

[0042] (3) Laser the square pattern on the bottom of the metal ring. After the laser pattern, apply underfill glue and perform defoaming baking. After baking, apply conductive silver glue and structural glue on the side of the metal ring, and then perform secondary baking;

[0043] (4) bonding the metal ring processed in step (3) on the elastic material described in step (2), and baking at a constant pressure;

[0044] (5) For the laser square pattern on the bottom of the PCB board and the upper part of the reinforcement board, apply structural glue to fit, bake;

[0045] (6) Dot structural glue on the cover...

Embodiment 3

[0053] A method for making a thinning fingerprint module with strong adhesion, comprising the following steps:

[0054] (1) The fingerprint identification chip is packaged on the PCB board through SMT technology;

[0055] (2) Wrap the side of the fingerprint chip assembled in step (1) with an elastic material, put it in a baking machine and bake it at 130°C for 1 hour;

[0056] (3) Laser the square pattern on the bottom of the metal ring. After the laser pattern, apply underfill glue and perform defoaming baking. After baking, apply conductive silver glue and structural glue on the side of the metal ring, and then perform secondary baking;

[0057] (4) bonding the metal ring processed in step (3) on the elastic material described in step (2), and baking at a constant pressure;

[0058] (5) For the laser square pattern on the bottom of the PCB board and the upper part of the reinforcement board, apply structural glue to fit, bake;

[0059] (6) Dot structural glue on the cover...

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Abstract

The invention discloses a manufacturing method of a thinned fingerprint module with strong adhesion, and relates to the field of fingerprint modules; it comprises the following steps: (1) packaging a fingerprint recognition chip on a PCB board through SMT technology; (2) packaging the fingerprint recognition chip on a PCB board; The side of the fingerprint chip is wrapped with elastic material; (3) laser square patterns on the bottom of the metal ring, apply underfill glue and perform defoaming baking, after baking, apply conductive silver glue and structural glue on the side of the metal ring for secondary baking; (4) Attach the processed metal ring to the elastic material and bake at constant pressure; (5) Lay the square pattern on the bottom of the PCB board and the upper part of the reinforcement board with structural glue and bake; (6) Dot structural glue on the cover plate, attach the cover plate on the fingerprint identification chip, and make the thinned fingerprint module with strong adhesion; the fingerprint module made by the present invention has a thinner thickness, and the metal ring The gap between the chip and the chip is more uniform and the gap becomes smaller.

Description

Technical field: [0001] The invention relates to the field of fingerprint modules, in particular to a method for manufacturing a thinned fingerprint module with strong adhesion. Background technique: [0002] The fingerprint module is the core component of the fingerprint lock, which is installed on devices such as fingerprint access control or hard disk, and is used to complete the collection of fingerprints and the identification of fingerprints. [0003] The fingerprint identification system collects, analyzes and compares living fingerprints through special photoelectric conversion equipment and computer image processing technology, and can quickly and accurately identify personal identities. The system generally mainly includes processes such as fingerprint image collection, fingerprint image processing, feature extraction, comparison and matching of feature values. Modern electronic integrated manufacturing technology makes fingerprint image reading and processing equ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K9/00C08L9/06C08L9/00C08L83/04C08K3/22C08K3/26C08K5/09C08J5/18
CPCC08J5/18C08L9/06C08K2003/2244C08L2205/03G06V40/12C08L9/00C08L83/04C08K3/22C08K3/26C08K5/09
Inventor 邹德林王晓峰
Owner 蚌埠华特科技有限公司
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