Horizontal adjustment mechanism of heating platform on full-automatic bonding equipment

Abstract

The invention discloses a horizontal adjustment mechanism of a heating platform on full-automatic bonding equipment, and solves the technical problem of time and labor consumption of a traditional heating platform during adjustment. The horizontal adjustment mechanism is characterized in that a heating table support rack (2) is fixedly arranged on a bonding machine operating platform (1), a workbench top plate (3) is fixedly arranged on the heating table support rack (2), three threaded holes (4) are formed in the workbench top plate (3), connection lines of the three threaded holes (4) form atriangle, a screw rod (5) is in threaded connection with each threaded hole (4), a heating platform (8) is arranged at top ends of the three screw rods (5), a prop-against groove (9) is formed in a bottom end surface of the heating platform (8), a screw rod prop-against ball head (6) is arranged at a top end of the screw rod, the screw rod prop-against ball head props against the prop-against groove (9), and an adjustment button (7) is arranged on the screw rod. By the horizontal adjustment mechanism, the height of the workbench can be continuously adjusted, so that the heating workbench reaches a horizontal state.

Description

technical field [0001] The invention relates to a level-adjustable mechanism, in particular to a level-adjusting mechanism of a heating platform in a fully automatic bonding device. Background technique [0002] In the production process of integrated circuit devices, the chips and substrates are first made, the chips are bonded to the substrates, and the substrates with the chips are placed on the heating platform of the automatic wire bonding equipment. The automatic wire bonding equipment The rivet with the gold wire on it moves to the pad of the chip, releases the ultrasonic wave, and welds one end of the gold wire to the pad of the chip, then lifts the rivet and moves the fully automatic wire bonding equipment The heating platform with the gold wire is moved and lowered to the pad of the substrate, the ultrasonic wave is released, the other end of the gold wire is welded to the pad of the substrate, and then the rivet is lifted to realize the bonding between the chip an...

AI Technical Summary

Problems solved by technology

[0003] The invention provides a level adjustment mechanism of the heating platform on the fully automatic bonding equipment, which solves the time-consuming and labor-intensive technical problem of the existing heating platform adjustment

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