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Curved surface bonding device and curved surface bonding method

A technology of bonding device and curved surface, applied in the packaging and display fields of electronic devices, can solve the problems of long pressure time, large pressure value change, pressure injury and crushing, and achieve the effect of reducing the risk of damage

Active Publication Date: 2021-04-27
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] From the above, it can be seen that in the entire curved surface bonding process, the middle area of ​​the flexible panel 12 is the first to contact the curved surface cover plate 13, and the press time is the longest, and the upper and lower sides of the middle area are respectively pushed by the motor to push the pressure head 11. The transmitted thrust and the resistance pressure of the curved cover plate 13, the pressure value changes greatly, and the risk of crushing and crushing is very high

Method used

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  • Curved surface bonding device and curved surface bonding method
  • Curved surface bonding device and curved surface bonding method
  • Curved surface bonding device and curved surface bonding method

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Embodiment Construction

[0020] The following clearly and completely describes the technical solutions of each exemplary embodiment provided in the present application with reference to the drawings in the embodiments of the present application. In the case of no conflict, the following embodiments and features in the embodiments can be combined with each other. Moreover, the directional terms used throughout the application, such as "up", "down", etc., are for better describing the technical solutions of various embodiments, and are not used to limit the protection scope of the application.

[0021] The present application firstly provides a curved surface bonding device of an embodiment, which is used to realize bonding between a flexible panel and a curved surface cover through a pressure head, wherein the flexible panel can be an existing flexible display panel, such as an OLED (Organic Light- Emitting Diode (Organic Light Emitting Diode) panel, the curved cover can be a curved glass cover for cov...

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Abstract

The application discloses a curved surface bonding device and a curved surface bonding method. The curved surface bonding device includes a hollow indenter, the pressing surface of the front end of the indenter is a curved surface, the radial dimension of the curved surface is larger than the radial dimension of the curved surface cover plate, and the edge area of ​​the indenter is under pressure. In this state, the radial dimension of the curved surface is smaller than the radial dimension of the curved surface cover plate, and the flexible panel is attached to the pressing surface of the front end of the indenter. After the middle area of ​​the indenter is resisted by the curved surface cover plate, the edge of the indenter The region releases pressure and rebounds to drive the flexible panel to fit the curved cover. Based on this, the present application can help reduce the risk of damage to the flexible panel during the curved surface bonding process.

Description

technical field [0001] The present application relates to the field of display, in particular to the field of packaging of electronic devices, and in particular to a curved surface bonding device and a curved surface bonding method. Background technique [0002] With the development of display technology, curved display devices with flexible panels are becoming more and more popular. Flexible panels have the advantages of being lighter, thinner, bendable, and more flexible, and their durability is much higher than that of traditional display panels, which can reduce the probability of accidental damage to display devices. Among them, the curved surface bonding process (also known as 3D bonding process) is the key to realize the mass production of curved surface display devices. The so-called curved surface bonding process refers to bonding a flexible panel to a curved surface cover to realize a curved surface display. The flexible panel can For the existing flexible display...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F3/041G06F1/16G09F9/30
CPCG06F1/1652G06F3/0412G06F2203/04102G06F2203/04103G09F9/301
Inventor 钟双
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD