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Semiconductor packaging device

A technology for packaging equipment and semiconductors, which is used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., and can solve problems such as low processing efficiency

Active Publication Date: 2018-10-30
江苏爱矽半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of existing semiconductor component packaging equipment is that the processing efficiency is low

Method used

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  • Semiconductor packaging device
  • Semiconductor packaging device
  • Semiconductor packaging device

Examples

Experimental program
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Embodiment Construction

[0029] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0030] Such as Figure 1-Figure 16 The shown semiconductor packaging equipment includes a frame assembly 1 and a semiconductor feeding device 2 on it, a semiconductor positioning device 3, a handling robot device 4 and an automatic packaging device 5; the semiconductor feeding device 2 is fixedly arranged on the frame assembly 1 , the semiconductor feeding device 2 is used to realize the feeding function of semiconductors to be packaged. The semiconductor positioning device 3 is connected with the semiconductor feeding device 2, and the semiconductor positioning device 3 is used for positioning the semiconductor to be packaged to improve the accuracy of clamping. The transport robot device 4 is used for transporting semiconductor workpieces between the semiconductor feeding device 2 , the semiconductor positioning device 3 and the automatic packaging d...

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PUM

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Abstract

The invention relates to the technical field of semiconductors. A semiconductor packaging device comprises a rack assembly, a semiconductor feeding device, a semiconductor positioning device, a conveying mechanical arm device and an automatic packaging device. The semiconductor feeding device, the semiconductor positioning device, the conveying mechanical arm device and the automatic packaging device are arranged on the rack assembly; the semiconductor positioning device is connected with the semiconductor feeding device; and the automatic packaging device is connected with the semiconductor positioning device. The semiconductor packaging device has advantages that feeding of semiconductor components and parts, material cups and thermal sealing films can be finished in a fully automatic manner, packaging of the semiconductor components and parts can be finished, and high machining efficiency is obtained.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to production equipment for semiconductor components. Background technique [0002] After the production and testing of semiconductor components are completed, the semiconductor components must be put into insulating cups and then sealed with heat-sealing film. The existing packaging method is as follows: through the movement of the manipulator, the semiconductor components are placed one by one into the filling chamber of the insulating cup with a fixed position. The cups are arranged regularly, and the filling chamber of a row of insulating cup is filled After the semiconductor components are finished, move the insulating cup to the bottom of the hot-pressed film equipment, and the hot-pressed film will seal the material chamber to complete the packaging of the semiconductor components. The disadvantage of existing packaging equipment for semiconductor components is low pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67126
Inventor 王加骇
Owner 江苏爱矽半导体科技有限公司