Electronic component mounting board, electronic device, and electronic module
An electronic component installation, electronic component technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problem of shadows around insulating substrates
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no. 1 Embodiment approach
[0034] refer to Figure 1 ~ Figure 3 , the electronic device 21 and the electronic component mounting substrate 1 according to the first embodiment of the present invention will be described. An electronic device 21 according to the present embodiment includes an electronic component mounting substrate 1 and an electronic component 10 . in addition, Figure 1 ~ Figure 3 Electronics 21 are shown, image 3 An electronic module is shown.
[0035] The electronic component mounting substrate 1 has a base portion 2 a having a mounting region 4 on which an electronic component 10 is mounted on the upper surface. The base portion 2 a has electrode pads 3 located at the ends of the mounting region 4 in plan view. The board|substrate 1 for electronic component mountings has the frame body 2b located in the upper surface of the base part 2a at the position outside the electrode pad 3 of the base part 2a. The side surface of the frame body 2b is inclined from the upper end to the low...
no. 2 Embodiment approach
[0087] Next, refer to Figure 4 , the electronic component mounting substrate 1 according to the second embodiment of the present invention will be described. The electronic component mounting substrate 1 of the present embodiment is different from the electronic component mounting substrate 1 of the first embodiment in that the side surface of the base portion 2a is inclined from the upper end to the lower end.
[0088] exist Figure 4 In the example shown, the side surface of the base portion 2a is inclined from the upper end to the lower end of the base portion 2a, and expands outward from the upper end to the lower end in plan view. Thus, in the process of connecting the substrate 2 in the state where the frame body 2b has been bonded to the base 2a to an external circuit board, or in the process of image recognition in the process of mounting the electronic component 10 with the outer edge of the base 2a as a reference, it is possible to It is possible to reduce misreco...
no. 3 Embodiment approach
[0093] Next, refer to Figure 5 , the electronic component mounting substrate 1 according to the third embodiment of the present invention will be described. The electronic component mounting substrate 1 of the present embodiment differs from the electronic component mounting substrate 1 of the second embodiment in that the inclinations of the side surfaces of the base portion 2 a and the frame body 2 b continue.
[0094] exist Figure 5 In the example shown, the side surface of the base portion 2a is inclined from the upper end to the lower end of the base portion 2a and spreads outward from the upper end to the lower end in plan view. Furthermore, the side surfaces of the base portion 2a and the frame body 2b are continuously inclined from the upper end of the frame body 2b to the lower end of the base portion 2a. Thus, in the image recognition process of the process of connecting the substrate 2 to an external circuit substrate or the process of mounting the electronic co...
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Abstract
Description
Claims
Application Information
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