A semiconductor chip production process

Abstract

The invention belongs to the technical field of semiconductor manufacturing, in particular to a semiconductor chip production process, which comprises the following steps: placing a wafer on a grinderto be ground to have a mirror surface; sending the wafer into a high-temperature diffusion furnace for oxidation treatment; sending the wafer to a spin coater for coating photoresist; feeding the wafer into a photolithography machine for exposure and development; feeding the wafer into an etching machine for plasma etching; and sending the wafer into a high-temperature furnace for doping. The spin coater of the invention is characterized in that a spin coating plate is arranged above the working table, the No. 1 motor drives the spin coating plate to rotate stably, the electric cylinder drives the No. 1 motor and the spin coating plate to move downwards uniformly, and the spin coating plate uniformly spreads the glue liquid onto the wafer surface, thereby realizing uniform and stable glueleveling; through the mutual cooperation of slider No. 1 and a blowing pipe, the dust on the surface of the workbench is blown to all sides, and then is brought away by air flow ejected from the blowing groove.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, in particular to a semiconductor chip production process. Background technique [0002] Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits. Wafer is the carrier used in the production of integrated circuits. In general, wafers refer to single crystal silicon wafers. Wafers are the most commonly used semiconductor materials. The photolithography process includes steps such as wafer leveling, pre-baking, exposure, development, film hardening, corrosion, and degumming. Among them, the leveling is to make the photoresist distributed on the wafer uniform and reach a certain thickness, so that During exposure, the photoresist on the surface of the wafer can be properly photosensitive; when uniforming the glue, the motor is usually used to drive the wafer adsorbed on the vacuum chuck to rotate, so that the glue is evenly distributed o...

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Problems solved by technology

[0004] The glue leveling process in this technical solution realizes that the entire workbench is in a horizontal state by adjusting the threaded rod, thereby ensuring the uniform thickness of the coating glue, but the rotation of the motor above the workbench in this solution will vibrate, and then make the above workbench The suction cup shakes, which affects the uniformity of the glue layer; the fan installed above the wafer can only ensure that the air above the wafer is flowing, and does not block the dust from the source; the glue is evened by centrifugal method, and the glue is blown out by centrifugal force. Throwing it out, the surface of the uniform glue cannot be guaranteed to be a smooth plane, and the quality of the wafer cannot be guaranteed 100%.

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