A heterogeneous substrate integrated structure and preparation method

Abstract

The invention discloses a heterogeneous substrate integrated structure and a preparation method. The heterogeneous substrate integrated structure comprises an organic metal wiring layer and a plurality of heterogeneous substrates, wherein the organic metal wiring layer is connected with bonding pads, which need to be interconnected, of various heterogeneous substrates; electric connection betweenthe heterogeneous substrates is achieved through the organic metal wiring layer; and the organic metal wiring layer completely covers the surfaces, which need to be directly interconnected, of variousheterogeneous substrates and becomes one part of metal wiring layers of the heterogeneous substrates, or the organic metal wiring layer is lapped on the surfaces, which need to be directly interconnected, of two adjacent heterogeneous substrates. According to the heterogeneous substrate integrated structure, the problem of space interconnection between various heterogeneous substrates is solved;the advantages of the substrates are fully developed to reach the optimal system performance; and the heterogeneous substrate integrated structure has a good economic prospect.

Description

technical field [0001] The invention belongs to the field of advanced electronic packaging, and relates to a packaging substrate used in semiconductor electronic microsystems and component hybrid integrated packaging, in particular to a heterogeneous substrate integration structure and preparation method. Background technique [0002] Under the premise that the portable intelligent system has continuously improved the function and performance requirements of electronic products, the size and weight of electronic products are also required to be continuously reduced. It is usually necessary to realize the functions of the entire electronic system in a small space, that is, to realize the miniature electronic system. Here we call it a microsystem for short. In view of the complexity of the microsystem and the diversity of devices involved, the microsystem may contain different forms of chips, devices and subassemblies, which may be bare chips, plastic-encapsulated, ceramic-enc...

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Problems solved by technology

[0003] The purpose of the present invention is to provide a heterogeneous substrate integration structure and preparation method to overcome the problems existing in the prior art. Excellent system performance, with good economic prospects

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