Manufacturing method for buffer and damping insole

A manufacturing method and insole technology, which is applied in the field of insoles, can solve the problems of insole production limitations and achieve the effects of improving wearing comfort, simple manufacturing process, and high molding efficiency

Active Publication Date: 2018-11-13
泉州邦尼生物科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is no simple and reasonable way to produce the insole in the market at present, which limits the production of the insole

Method used

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  • Manufacturing method for buffer and damping insole

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Effect test

Embodiment Construction

[0018] The present invention will be further described in conjunction with the accompanying drawings and specific embodiments.

[0019] refer to figure 1 1. A cushioning and shock-absorbing insole disclosed in an embodiment of the present invention, a TPU shock-absorbing insole, includes an insole body 1, a memory shock-absorbing layer 31 arranged on the bottom heel area of ​​the insole body 1, and the forefoot area. The bottom of the insole body 1 is provided with a support layer 4 at the arch of the foot, and the support layer 4 extends toward the heel area. The shock-absorbing groove that passes through the supporting layer 4. In order to wear more comfortably, the surface of the insole body is also provided with a cloth layer 5 .

[0020] The manufacturing method of the above-mentioned cushioning and shock-absorbing insole includes: a manufacturing method of the cushioning and shock-absorbing insole, including:

[0021] 1) Fix the prepared arch support layer on the arch...

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PUM

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Abstract

The invention provides a manufacturing method for a buffer and damping insole. The manufacturing method comprises the steps that (1) a foot arch supporting layer is fixed to a foot arch part of a mold; (2) a memory damping layer is baked to be softened; (3) the softened memory damping layer is placed into an insole molding groove of the mold, the foot arch supporting layer is arranged at the footarch position of the memory damping layer, a hot melting film layer is placed between the foot arch supporting layer and the memory damping layer, and a vacuum plastic uptake pump is further arrangedat the position, located at the lower portion in the insole molding groove, of the mold; (4) the vacuum plastic uptake pump conducts surface line sucking treatment on the bottom surface of the foot arch supporting layer and the forefoot and heelpiece parts of the memory damping layer, the plastic uptake temperature and plastic uptake pressure during plastic uptake and the hot melting effect of thehot melting film layer are used for thermal compounding of the foot arch supporting layer to the foot arch position of the memory damping layer, and the memory damping layer compounded with the footarch supporting layer is obtained; (7) cutting is carried out; and (9) the memory damping layer compounded with the supporting layer is placed into an injection mold for injection molding of an insolebody.

Description

technical field [0001] The invention relates to the technical field of insoles, in particular to a method for making cushioning and shock-absorbing insoles. Background technique [0002] Most of the common insoles on the market are made of solid structure, and the physical properties of materials such as EVA are used for cushioning. However, due to the limited performance of the material itself, there is a compression limit and a rebound limit that cannot respond quickly after being impacted by the sole of the foot. , and after a period of use, the material ages and collapses, and cannot play the role of cushioning and shock absorption; the insole has poor air permeability, which easily causes the soles of the user to sweat. [0003] Therefore, if figure 1 , the inventor has studied a TPU shock-absorbing insole, including an insole body 1, a memory shock-absorbing layer 31 arranged on the heel area and the forefoot area of ​​the bottom of the insole body 1, and the bottom o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29D35/14
CPCB29D35/14
Inventor 秦壮利李宁吕正军谢光坤
Owner 泉州邦尼生物科技有限公司
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