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Gold finger structure

A gold finger and groove technology, applied in the field of gold fingers, can solve problems such as impedance discontinuity, and achieve the effect of solving impedance discontinuity and increasing impedance

Inactive Publication Date: 2020-03-17
NANNING FUGUI PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, it is necessary to provide a gold finger structure, which can not only solve the problem of impedance discontinuity caused by the width of the gold finger device itself when the pad is wider than the transmission line, but also avoid various problems caused by traditional processing methods. insufficient

Method used

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Embodiment Construction

[0037] Please refer to figure 1 , the golden finger structure provided in a specific embodiment of the present invention includes at least one golden finger disposed on the substrate 10 and a transmission line 20 disposed on the substrate 10 and connected to the golden finger. Two gold fingers in the embodiment of the present invention are taken as an example, but not limited thereto, and they are gold fingers 30 and 40 respectively.

[0038] The gold fingers 30, 40 are each provided with several grooves 50, the several grooves are arranged up and down, and two adjacent grooves 50 are arranged oppositely, that is, the several grooves 50 are in a staggered up and down manner. Relatively arranged, the ends of two spaced grooves are on the same straight line, but the ends of two adjacent grooves are not on the same straight line. In this embodiment, the number of grooves 50 provided on the gold fingers 30 and 40 is related to the width of the gold fingers and the width of the tr...

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PUM

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Abstract

A gold finger structure includes at least one gold finger arranged on a substrate and a transmission line arranged on the substrate and connected to the gold finger. Several grooves are arranged on the golden finger, and two adjacent grooves are arranged opposite to each other. The gold finger structure provided by the present invention can not only solve the problem of impedance discontinuity caused by the pad width of the gold finger device itself being wider than the transmission line, but also avoid various shortcomings caused by traditional processing methods.

Description

technical field [0001] The invention relates to a gold finger, in particular to a gold finger structure. Background technique [0002] Printed circuit board (Printed Circuit Board, PCB board), also known as printed circuit board, printed circuit board, is an important part of the physical support of electronic products and signal transmission. The width of the pad (Pad) is wider than that of the transmission line (Transmission Line). If there is no certain treatment, the impedance here will usually be much lower than the impedance of the transmission line, which will lead to impedance discontinuity, which will cause signal reflection and seriously affect The quality of the signal. [0003] The traditional processing method is to dig out all the reference planes under the gold finger, that is, there is no reference below. From the impedance calculation formula, it can be known that if the reference vertical or horizontal reference plane of the gold finger is deepened, part o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/11
CPCH05K1/117H05K2201/09745H01P5/028H05K1/025H05K2201/09263H05K1/0245
Inventor 王相为
Owner NANNING FUGUI PRECISION IND CO LTD