A method for improving heat dissipation of polypropylene film
A technology of polypropylene film and heat dissipation method, which is applied to the parts of fixed capacitors, capacitors, electrical components, etc., can solve the problem of less polypropylene film, and achieve the effect of improving heat dissipation capacity.
Inactive Publication Date: 2020-07-03
TIANJIN UNIV
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Problems solved by technology
However, there are few studies on improving the heat dissipation capacity of polypropylene films by modifying polypropylene as the capacitor dielectric
Method used
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[0017] The present invention will be further described below in conjunction with the accompanying drawings.
[0018] A method for improving heat dissipation of polypropylene film, comprising the following steps
[0019] 1. Select a biaxially oriented polypropylene (BOPP) film sample with a thickness of 40 μm, cut it into a size of 80×80 mm, wipe the polypropylene (BOPP) film sample with absolute ethanol, and place it in a drying oven Drying was carried out for 2 hours.
[0020] 2. Open the sputtering chamber of the FJL560D2 magnetron sputtering system, fix the sample on the turntable, and install a circular boron nitride target with a purity of 99.99% on the RF target head. The diameter of the boron nitride target is 60mm, the thickness is 3mm, and the target is bound to a 2mm copper back target. Adjust the boron nitride target to the position directly above the sample, and close the chamber.
[0021] 3. Fill the sputtering chamber with N 2 gas, the vacuum of the sputterin...
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Abstract
The invention discloses a method for improving the heat dissipation of a polypropylene film. The method comprises the following steps of (1) wiping a polypropylene film sample clean with absolute ethanol, placing the sample into a drying oven and drying the sample for 2 hours, (2) opening a sputtering chamber, fixing the polypropylene film sample on a turntable, installing a circular boron nitridetarget material with the purity of 99.99% on an RF target head, adjusting the boron nitride target material to a position directly above the polypropylene film sample, and closing the sputtering chamber, wherein the boron nitride target material is bound with a 2mm copper back target, (3) filling the sputtering chamber with N2 gas, pumping the vacuum degree of the sputtering chamber to be below 10<-3>Pa, inputting Ar gas, allowing the vacuum degree of the sputtering chamber to be 10<-3>Pa, turning on an RF power supply, adjusting the sputtering power to be 70W, and sputtering the polypropylene film sample for 30 min and 60 min separately, and (4) filling the sputtering chamber with air after the sputtering is completed such that the air pressure in the sputtering chamber is the same as the atmospheric pressure, opening the chamber, and taking the polypropylene film sample out. According to the method, the heat dissipation capability of the polypropylene film can be effectively improved.
Description
technical field [0001] The invention relates to research in the field of heat dissipation of polypropylene films, in particular to a method for improving heat dissipation of polypropylene films. Background technique [0002] Power capacitors play an irreplaceable role in today's power systems, and their main applications are filtering and reactive power compensation. Polypropylene film is currently the main dielectric material used in power capacitors. Power capacitors inevitably have electrodes and dielectric heating phenomena during operation. Thermal aging is one of the main causes of capacitor failure, and its life decreases as the temperature rises. When the ambient temperature is high and the heat dissipation conditions are not good, the internal temperature of the capacitor is high. When an overvoltage occurs, the capacitor is easy to self-heal, and even short-circuit breakdown caused by self-healing failure occurs. [0003] In recent decades of research, some scho...
Claims
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IPC IPC(8): H01G4/18H01G2/08
CPCH01G2/08H01G4/18
Inventor 杜伯学许然然李进侯兆豪韩晨磊王明洋
Owner TIANJIN UNIV