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Radio frequency front-end module and an electronic device

A technology of RF front-end and modules, which is applied in the field of RF front-end modules and electronic devices, can solve the problems of increasing test workload and increasing costs, so as to save labor costs and time costs, reduce the number of pins, and reduce debugging workload Effect

Pending Publication Date: 2018-11-16
OPPO CHONGQING INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the production of mobile phones, mobile phones with different hardware structures will be produced in different regions. Due to the incompatibility of the RF front-end hardware, the high-hardware version of the mobile phone and the low-hardware version of the mobile phone must be tested separately, which increases the test workload. increased cost

Method used

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  • Radio frequency front-end module and an electronic device
  • Radio frequency front-end module and an electronic device
  • Radio frequency front-end module and an electronic device

Examples

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Embodiment Construction

[0013] In order to make the purpose, features and advantages of the present application more obvious and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described The embodiments are only some of the embodiments of the present application, but not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

[0014] see figure 1 , is a schematic structural diagram of a radio frequency front-end module provided by an embodiment of the present application. The radio frequency front-end module can be applied in electronic devices, and the electronic devices include mobile terminals such as mobile phones, tablet computers, and wearable devices.

[0015] Such as...

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PUM

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Abstract

The embodiments of the present invention provide a radio frequency front-end module and an electronic device, and relate to the technical field of a mobile terminal, where the radio frequency front-end module includes: a transmitting module, a first power amplifier, a communication transceiver chip, a first main set receiving path, and a first sending a path. One end of the first main set receiving path passes through the first power amplifier, the first main set receiving path and the first transmitting path of the same frequency band share a path and then access to the transmitting module, the first main set receiving path and the first transmitting path share the same pin of the transmitting module, and the other end of the first main set receiving path is connected to the communicationtransceiver chip. This application can reduce the cost of testing.

Description

technical field [0001] The present application relates to the technical field of mobile terminals, in particular to a radio frequency front-end module and an electronic device. Background technique [0002] With the development of mobile communications, mobile phones have become an essential communication tool for everyone. The radio frequency front end of the mobile phone is an important part of transmitting and receiving signals. During the production of mobile phones, mobile phones with different hardware structures will be produced in different regions. Due to the incompatibility of the RF front-end hardware, the high-hardware version of the mobile phone and the low-hardware version of the mobile phone must be tested separately, which increases the test workload. Increased costs. Contents of the invention [0003] The embodiment of the present application provides a radio frequency front-end module and electronic device, which can reduce the PIN pins of the transmiss...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B1/40H04B1/401H04B1/44H04B1/18H04B1/04H04B1/00
CPCH04B1/0067H04B1/04H04B1/18H04B1/40H04B1/401H04B1/44H04B2001/0408
Inventor 范润启刘求文
Owner OPPO CHONGQING INTELLIGENT TECH CO LTD
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