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Method, system and storage medium for controlling additives in mixed electroplating solution

A technology of electroplating additives and control methods, applied in the direction of electrolytic components, electrolytic processes, cells, etc., can solve problems such as increased chip complexity, and achieve the effect of avoiding air bubbles

Active Publication Date: 2020-07-31
长沙安牧泉智能科技有限公司
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  • Abstract
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  • Application Information

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Problems solved by technology

[0002] With the continuous development of integrated circuit (IC) devices towards multi-function and high density, the complexity of the chip has greatly increased, and the traditional single-chip packaging is difficult to meet the requirements. Three-dimensional (3D) packaging has become an inevitable trend in the field of IC device packaging. trend

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  • Method, system and storage medium for controlling additives in mixed electroplating solution
  • Method, system and storage medium for controlling additives in mixed electroplating solution
  • Method, system and storage medium for controlling additives in mixed electroplating solution

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Embodiment

[0066] In this embodiment, the first arrangement is figure 1 The experimental device of the three-electrode electrochemical test system shown, the basic electroplating solution contains copper sulfonate and a small amount of sodium chloride, which contains Cu 2+ The concentration is 0.63mol / L, CH 3 SO 3 ˉ The concentration is 0.21mol / L, Cl ˉ The concentration is 50 ppm; the electrode is set to rotate at 600 rpm; the injector is the electroplating additive solution to be tested.

[0067] The method for controlling additives in the mixed electroplating solution of this embodiment includes the following steps:

[0068] S1: Determine the electroplating additives to be interacted with are PEG, SPS and JGB;

[0069] S2: Perform a single first electroplating experiment for each electroplating additive in the mixed electroplating solution, and obtain the first constitutive equation of the relationship between the concentration, adsorption rate and potential of each electroplating additive by...

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Abstract

The invention discloses a method for controlling additives in a mixed electroplating solution. According to the principle that the adsorption rate of the electroplating additives changes at differentpotentials and interactions of the multiple electroplating additives under the potential influence are different, a synergistic, competitive or substituent relation of the multiple electroplating additives at different potentials is determined by experiments, the relation is specifically expressed as the third constitutive equation, and the quantity of the electroplating additives is controlled according to the third constitutive equation, so that required adsorption rate can be obtained accurately; the method has the advantages that the adsorption rate of the multiple electroplating additivescan be controlled accurately, electroplating defects can be avoided and the like. The invention further discloses a control system for implementing the method and a computer storage medium capable ofimplementing the method correspondingly. The control system and the computer storage medium have the advantages of the method as well.

Description

Technical field [0001] The invention relates to the technical field of integrated circuit packaging, in particular to a method for controlling additives in a mixed electroplating solution and a control system thereof, and a computer storage medium capable of realizing the method. Background technique [0002] With the continuous development of integrated circuit (IC) devices in the direction of multi-function and high-density, the complexity of their chips has greatly increased, and traditional single-chip packaging cannot meet the requirements. Three-dimensional (3D) packaging has become an inevitable trend in the field of IC device packaging. trend. Compared with traditional packaging, the use of 3D technology can reduce chip size and weight by 40-50 times; in terms of signal transmission speed, the power saved by 3D technology can make 3D components operate at a faster transmission speed per second without increasing energy Consumption. [0003] 3D packaging realizes the inter...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D21/14
CPCC25D21/14
Inventor 朱文辉吴厚亚王彦李祉怡
Owner 长沙安牧泉智能科技有限公司
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