Structure, electronic equipment, decoration film, and method for manufacturing structure
A manufacturing method and structure technology, applied in the direction of electrical equipment shells/cabinets/drawers, decorations, electronic equipment, etc., can solve the problems of difficult to form film thickness, easy to damage island structure, etc., and achieve high design effect
Active Publication Date: 2018-11-23
SONY CORP
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Problems solved by technology
[0003] However, in the method of forming an island structure of indium, there is a problem that it is difficult to form an overall uniform film thickness in the case of, for example, a large vapor deposition area
In addition, there is a problem that when forming the case member, the island-shaped structure is easily broken due to the temperature of the resin flowing therein (paragraphs 0007 and 0008 of the specification of Patent Document 1, etc.)
Method used
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Embodiment approach
[0139] The present technology is not limited to the above-described embodiments, and various other embodiments can be realized.
[0140] Figure 10is a cross-sectional view showing a configuration example of a gloss film according to another embodiment. In this glossy film 223 , a base portion 250 having a tensile breaking strength smaller than that of the metal layer 220 is provided as a member supporting the metal layer 220 . Thus, the elongation rate required to form the fine cracks 222 can be reduced. For example, the fine cracks 222 can be formed by a stretching ratio smaller than that required to break the metal layer 220 itself. This is because considering the Figure 10 As shown in A and 10B, after the surfaces of the base parts 250A and B, which have a small tensile breaking strength, are broken, the metal layer 220 is broken.
[0141] Such as Figure 10 As shown in A, as the base portion 250A, a base film having a small tensile breaking strength can be used. Fo...
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Abstract
A structure according to an embodiment of the present technology is provided with a decoration film and a housing part. The decoration film includes a metal layer having first regions in which additive concentration of a prescribed element is relatively high, second regions in which the additive concentration is relatively lower than that of the first regions, and minute cracks formed on the basisof the first regions. The housing part has a region to be decorated to which the decoration film is to be bonded.
Description
technical field [0001] The present technology relates to a structural body suitable for use in electronic equipment and the like, an electronic equipment to which the structural body is applied, a decorative film, and a method of manufacturing a case member. Background technique [0002] Conventionally, a member having a metal-like appearance while being capable of transmitting electromagnetic waves such as millimeter waves has been designed as a housing part of an electronic device or the like. For example, Patent Document 1 discloses an exterior component for mounting an automobile radar on a logo of an automobile. For example, indium is vapor-deposited on a resin film and the film is attached to the surface layer of a car logo by an Insert Molding method. Thus, it is possible to manufacture an exterior member that has a decorative metallic luster and does not have an absorption region in the electromagnetic wave band due to the island structure of indium (paragraph 0006 ...
Claims
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IPC IPC(8): B32B15/08B29C45/14
CPCB29K2715/006B29K2995/007B29C45/14811B29C45/14827B29C55/02B29K2705/02B29K2705/14B29L2031/3481B29L2031/722C23C14/081C23C14/0021C23C14/562B32B15/08B29C45/1679B32B3/10B32B15/20B32B2451/00B32B2457/00C23C14/20C23C14/5886H05K5/0243H05K5/04
Inventor 下田和人阿部淳博
Owner SONY CORP