A kind of toughened reinforced epoxy resin composition
An epoxy resin and composition technology, which is applied in the field of epoxy resin modification, can solve the problem that the matrix resin lacks covalent bond connection, material crosslinking density, mechanical strength and thermomechanical properties decline, and cannot effectively participate in epoxy resin curing. Reaction and other problems, to achieve the effect of simple preparation method, good interfacial compatibility and binding force
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Embodiment 1
[0029] (1) Preparation of modifier
[0030] First, add 50 mL of absolute ethanol, 4.5 mL of deionized water and 1.35 mL of ammonia water with a concentration of 25 to 28 wt % in a three-necked flask, and stir magnetically at 50 ° C for 20 minutes; then add 1.5625 g (7.5 mmol) of tetrasilicic acid dropwise Ethyl ester, stirred for 30 minutes, until blue opalescence is produced; then continue to add 0.4783g (2.5mmol) 3-aminopropylmethyldiethoxysilane and 1.35mL ammonia water, pass N 2 protection, carry out hydrolysis and condensation reaction for 5 hours; finally centrifuge, and wash the product three times with ethanol repeatedly to obtain silica particles with amino groups on the surface (SiO 2 -NH 2 ), ultrasonically disperse it in 25mL acetone, and set aside.
[0031] Dissolve 1.5 g of poly(styrene-alt-maleic anhydride) (weight average molecular weight 20,000 g / mol) in 25 mL of acetone, and add it dropwise to the above SiO 2 -NH 2 In the acetone dispersion liquid, the am...
Embodiment 2
[0037] (1) Preparation of modifier
[0038] Same as Example 1
[0039] (2) Preparation of epoxy resin composition
[0040] 50g bisphenol A type epoxy resin (E51), 42g curing agent methyl hexahydrophthalic anhydride, 0.5g curing accelerator ethyl triphenyl acetate phosphorus, 0.5g SMA-SiO 2 Mix evenly with a high-speed homogenizer to obtain an epoxy resin composition.
Embodiment 3
[0042] (1) Preparation of modifier
[0043] Same as Example 1
[0044] (2) Preparation of epoxy resin composition
[0045] 50g bisphenol A type epoxy resin (E51), 42g curing agent methyl hexahydrophthalic anhydride, 0.5g curing accelerator ethyl triphenyl acetate phosphorus, 1g SMA-SiO 2 Mix evenly with a high-speed homogenizer to obtain an epoxy resin composition.
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