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A kind of toughened reinforced epoxy resin composition

An epoxy resin and composition technology, which is applied in the field of epoxy resin modification, can solve the problem that the matrix resin lacks covalent bond connection, material crosslinking density, mechanical strength and thermomechanical properties decline, and cannot effectively participate in epoxy resin curing. Reaction and other problems, to achieve the effect of simple preparation method, good interfacial compatibility and binding force

Active Publication Date: 2020-01-21
JIANGNAN UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although the introduction of the above-mentioned polymers can play the role of compatibilizer to a certain extent and improve the compatibility between inorganic particles and matrix resin, it cannot effectively participate in the curing reaction of epoxy resin, and lacks covalent bond with matrix resin. key connection
Therefore, while toughening, it will still lead to a decrease in the crosslinking density, mechanical strength and thermomechanical properties of the material.

Method used

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  • A kind of toughened reinforced epoxy resin composition
  • A kind of toughened reinforced epoxy resin composition
  • A kind of toughened reinforced epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] (1) Preparation of modifier

[0030] First, add 50 mL of absolute ethanol, 4.5 mL of deionized water and 1.35 mL of ammonia water with a concentration of 25 to 28 wt % in a three-necked flask, and stir magnetically at 50 ° C for 20 minutes; then add 1.5625 g (7.5 mmol) of tetrasilicic acid dropwise Ethyl ester, stirred for 30 minutes, until blue opalescence is produced; then continue to add 0.4783g (2.5mmol) 3-aminopropylmethyldiethoxysilane and 1.35mL ammonia water, pass N 2 protection, carry out hydrolysis and condensation reaction for 5 hours; finally centrifuge, and wash the product three times with ethanol repeatedly to obtain silica particles with amino groups on the surface (SiO 2 -NH 2 ), ultrasonically disperse it in 25mL acetone, and set aside.

[0031] Dissolve 1.5 g of poly(styrene-alt-maleic anhydride) (weight average molecular weight 20,000 g / mol) in 25 mL of acetone, and add it dropwise to the above SiO 2 -NH 2 In the acetone dispersion liquid, the am...

Embodiment 2

[0037] (1) Preparation of modifier

[0038] Same as Example 1

[0039] (2) Preparation of epoxy resin composition

[0040] 50g bisphenol A type epoxy resin (E51), 42g curing agent methyl hexahydrophthalic anhydride, 0.5g curing accelerator ethyl triphenyl acetate phosphorus, 0.5g SMA-SiO 2 Mix evenly with a high-speed homogenizer to obtain an epoxy resin composition.

Embodiment 3

[0042] (1) Preparation of modifier

[0043] Same as Example 1

[0044] (2) Preparation of epoxy resin composition

[0045] 50g bisphenol A type epoxy resin (E51), 42g curing agent methyl hexahydrophthalic anhydride, 0.5g curing accelerator ethyl triphenyl acetate phosphorus, 1g SMA-SiO 2 Mix evenly with a high-speed homogenizer to obtain an epoxy resin composition.

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Abstract

The invention discloses a toughened and enhanced epoxy resin composition and belongs to the technical field of epoxy resin modification. The epoxy resin composition contains epoxy resin, a curing agent, a curing promoter and a modifier. The modifier is silicon dioxide / poly(styrene-alt-maleic anhydride) hybrid particles which have a core-shell structure taking silicon dioxide as a core and poly(styrene-alt-maleic anhydride) as a shell. The hybrid particles have a good interfacial bonding force with an epoxy resin system. The epoxy resin composition has a good application prospect in the fieldsof an epoxy resin adhesive, a coating, a composite material, a copper-clad plate, an electronic packaging material and the like.

Description

technical field [0001] The invention relates to a toughened and enhanced epoxy resin composition, which belongs to the technical field of epoxy resin modification. Background technique [0002] Epoxy resin is a general term that contains two or more epoxy groups in one molecule and can chemically react with a curing agent to form a three-dimensional crosslinked network cured product. There are many types of epoxy resins, and their molecular weights belong to the range of oligomers. According to their chemical structures, they can be divided into glycidyl ethers, glycidyl esters, glycidyl amines, and aliphatic epoxy compounds. Epoxy resin is widely used in epoxy adhesives, coatings, composite materials, copper clad laminates, electronic packaging materials and other fields due to its good electrical insulation performance, stability, and high hardness. However, epoxy resins generally have high crosslinking density and large internal stress after curing, resulting in insuffic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L87/00C08G83/00
CPCC08G83/001C08L63/00C08L87/00
Inventor 魏玮崔玉青李小杰费小马刘晓亚
Owner JIANGNAN UNIV