Pretreatment device for copper-clad steel wires
A pretreatment device and copper-clad steel wire technology are applied in coating, metal material coating process, hot-dip plating process, etc., which can solve problems such as poor welding performance, muddy plating solution, and poor solderability of the plating layer, and achieve The effect of improving the utilization rate and improving the effect
Inactive Publication Date: 2018-11-27
德清县欣琪电子有限公司
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Problems solved by technology
The current tin plating solution can be used to obtain a bright coating on the surface of the lead wire, but the solderability of the coating is poor, and after the lead wire is stored in the air for 2 to 6 months, the coating becomes grayish black, and the welding performance is even worse.
In addition, the plating solution itself is also very unstable. If it is placed in the air for 1 to 2 months, the plating solution will become cloudy, which will seriously affect the brightness and solderability of the coating.
[0003] At the same time, the bonding rate between the coating and the lead is poor, and the coating will slowly fall off after the lead is stored in the air for 2 to 6 months
Method used
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[0016] The present invention will be described in further detail below through specific embodiments and in conjunction with the accompanying drawings.
[0017] Such as figure 1 , 2 , a pretreatment device for copper-clad steel wire shown in 3, including a cleaning device and a fluxing device connected successively before and after;
[0018] The cleaning device includes a cleaning tank 21 with an open top, and a reservoir 22 arranged below the clear water tank 21. The cleaning tank 21 is separated from front to back by two partitions 23 into a front lower pool 24, an inlet Pool 25 and rear lower pool 26, described dividing plate 23 is provided with the slit 27 that is convenient for copper-clad steel wire to pass through, and the front side wall of described front lower pool 24 and the rear side wall of rear lower pool 26 are all provided with Porcelain eye 9 is arranged, and the bottom of described water inlet pool 25 links to each other with water inlet pipe 28, and the bot...
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The invention discloses a pretreatment device for copper-clad steel wires. The pretreatment device comprises a cleaning device and a soldering aid device which are sequentially connected front and back. According to the pretreatment device, the copper-clad steel wires are cleaned by the cleaning device, clear water in a cleaning pool is recycled, and the utilization rate of the clear water is increased; soldering aid fluid is attached to the surfaces of the copper-clad steel wires through the soldering aid device, the tin plating effect is improved, the soldering aid fluid in a soldering aid fluid pool is recycled, and the utilization rate of the soldering aid fluid is increased.
Description
technical field [0001] The invention relates to a pretreatment device for copper-clad steel wire. Background technique [0002] In recent years, with the rapid development of the electronics industry, in order to improve the solderability and reduce costs of electronic components and materials, tin plating with good solderability is used to plate the leads of electronic components. The current tin plating solution can be used to obtain a bright coating on the surface of the lead wire, but the solderability of the coating is poor, and after the lead wire is stored in the air for 2 to 6 months, the coating becomes grayish black, and the welding performance is even worse. In addition, the plating solution itself is also very unstable. If it is placed in the air for 1 to 2 months, the plating solution will become cloudy, which will seriously affect the brightness and solderability of the coating. [0003] At the same time, the bonding rate between the coating and the lead is po...
Claims
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IPC IPC(8): C23C2/02C23C2/08C23C2/38
CPCC23C2/003C23C2/02C23C2/08C23C2/38
Inventor 谢坤生蔡建璋
Owner 德清县欣琪电子有限公司