Ultrasonic fingerprint recognizing module and manufacturing method thereof

Abstract

The invention relates to an ultrasonic fingerprint recognizing module and a manufacturing method thereof. The ultrasonic fingerprint recognizing module comprises: a substrate, a piezoelectric layer, aconducting layer and an electrode layer, wherein the piezoelectric layer is arranged on the substrate; the surface, which is far away from the substrate, of the piezoelectric layer is a function surface; a first step groove is arranged in the edge of the function surface; the conducting layer comprises a main body part arranged on the function surface, a first filling part arranged at the first step groove and a connecting part arranged on the surface, which is provided with the piezoelectric layer, of the substrate; the main body part, the first filling part and the connecting part are sequentially integrated; the connecting part is used for connecting with a power supply line; and the electrode layer is arranged on the surface, which is far away from the substrate, of the main body part. The ultrasonic fingerprint recognizing module has the advantages that the climbing amplitude of the conducting layer can be mitigated by utilizing the first step groove, so that the wire breakage risk of the conducting layer is reduced; an ox horn can be removed while the first step groove is arranged at the same time, so that the clamping amplitude of the conducting layer is avoided being increased by the ox horn and the wire breakage risk of the conducting layer is reduced; and therefore, the ultrasonic fingerprint recognizing module has better performance and higher manufacturing yield.

Description

technical field [0001] The invention relates to the technical field of fingerprint identification, in particular to an ultrasonic fingerprint identification module and a manufacturing method thereof. Background technique [0002] Electronic devices such as mobile phones and tablets are equipped with fingerprint identification modules, so that users can be easily and safely identified. With the gradual development of electronic devices towards full screens, fingerprint recognition modules need to be built into the screens, and people have begun to vigorously study ultrasonic fingerprint recognition modules that can be built into the screens. However, the performance of the traditional ultrasonic fingerprint recognition module is poor, and the production yield is low. Contents of the invention [0003] Based on this, it is necessary to provide an ultrasonic fingerprint identification module with better performance and a manufacturing method with higher yield. [0004] An u...

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Problems solved by technology

However, the performance of the traditional ultrasonic fingerpr

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